公开(公告)号：US11792928B2

公开(公告)日：2023-10-17

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184 ,  H05K3/429 ,  H05K2201/0979 ,  H05K2201/09518

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

公开(公告)号：US20190343001A1

公开(公告)日：2019-11-07

申请号：US16512351

申请日：2019-07-15

Applicant: ABB Schweiz AG

Inventor： Robert Joseph Roessler

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/42 ,  H05K3/00 ,  H05K1/11 ,  H05K3/30

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).

公开(公告)号：US10356906B2

公开(公告)日：2019-07-16

申请号：US15188681

申请日：2016-06-21

Applicant: ABB Schweiz AG

Inventor： Robert Joseph Roessler

IPC: H01K3/10 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/42

Abstract: A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.

公开(公告)号：US20230199958A1

公开(公告)日：2023-06-22

申请号：US17554288

申请日：2021-12-17

Applicant: ABB Schweiz AG

Inventor： John Andrew Trelford ,  Robert Joseph Roessler ,  Jose Daniel Rogers ,  Arturo Silva ,  Alok Lohia

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0047 ,  H05K3/421 ,  H05K1/184

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

公开(公告)号：US10820420B2

公开(公告)日：2020-10-27

申请号：US16512351

申请日：2019-07-15

Applicant: ABB Schweiz AG

Inventor： Robert Joseph Roessler

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/42

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).

公开(公告)号：US20190311840A1

公开(公告)日：2019-10-10

申请号：US15948383

申请日：2018-04-09

Applicant: ABB Schweiz AG

Inventor： Robert Joseph Roessler ,  Anjana Shyamsundar

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F41/063

Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.