公开(公告)号：US07531381B2

公开(公告)日：2009-05-12

申请号：US11307872

申请日：2006-02-26

Applicant: Jui-Hsiang Pan ,  Kuang-Shin Lee ,  Cheng-Kuang Sun

Inventor： Jui-Hsiang Pan ,  Kuang-Shin Lee ,  Cheng-Kuang Sun

IPC: H01L21/00

CPC classification number: H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The present invention provides a method for fabricating a quad flat no-lead package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/O pads of the chip carrier for the external circuitry. A plurality of pads, corresponding to bonding pads of the chip, is disposed on the top surface of the chip carrier. The aforementioned package structure can employ wiring bonding technology, flip chip technology or surface mount technology to attach the chip to the chip carrier.

Abstract translation: 本发明提供一种制造四边形扁平无引线封装结构的方法，其包括芯片载体和至少芯片。 芯片设置在芯片载体的顶表面上，而芯片载体的背面包括多个平坦的无导线导线作为用于外部电路的芯片载体的I / O焊盘。 对应于芯片的接合焊盘的多个焊盘设置在芯片载体的顶表面上。 上述封装结构可以采用布线接合技术，倒装芯片技术或表面贴装技术将芯片附接到芯片载体。

公开(公告)号：US07359002B2

公开(公告)日：2008-04-15

申请号：US10739635

申请日：2003-12-17

Applicant: Kuang-Chih Cheng ,  Cheng-Kuang Sun ,  Kuang-Hsing Lee

Inventor： Kuang-Chih Cheng ,  Cheng-Kuang Sun ,  Kuang-Hsing Lee

IPC: H04N5/225

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/48091 ,  H04N5/2252 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A camera module is provided. The camera module comprises: a holder having an upper portion, a lower portion, and a bottom; a lens member held on the upper portion of the holder; a hinge disposed on the bottom of the holder; a cover coupled to the hinge and to the bottom of the holder, the cover being allowed to open and close to cover the bottom of the holder, the cover and the lower portion of the holder forming a space; and an image sensing and processing device disposed on the cover, wherein when the cover is close, the space can accommodate the image sensing and processing device.

Abstract translation: 提供相机模块。 相机模块包括：具有上部，下部和底部的保持器; 保持在所述保持器的上部的透镜构件; 设置在所述保持器的底部上的铰链; 盖子，其联接到所述铰链和所述保持器的底部，所述盖子被允许打开和关闭以覆盖所述保持器的底部，所述盖子和所述保持器的下部形成空间; 以及设置在所述盖上的图像感测和处理装置，其中当所述盖靠近时，所述空间可以容纳所述图像感测和处理装置。

公开(公告)号：US06930398B1

公开(公告)日：2005-08-16

申请号：US10708761

申请日：2004-03-24

Applicant: Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Kuang-Shin Lee

Inventor： Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Kuang-Shin Lee

IPC: H01L23/48

CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package structure for optical image sensing devices is disclosed. The package structure includes an image sensing integrated circuit chip having a light receiving side and a backside. The image sensing integrated circuit chip has a light sensing area on the light receiving side. A plurality of light sensing devices are arranged in the light sensing area for converting incident light into electrical signals. A plurality of bonding pads are arranged along one or two sides of the light sensing area. Black sealing glue is asymmetrically coated on the outskirts of the light sensing area. The black sealing glue has at least two coating widths. A glass lid is glued over the light sensing area with the sealing glue.

Abstract translation: 公开了一种用于光学图像感测装置的封装结构。 封装结构包括具有光接收侧和背面的图像感测集成电路芯片。 图像感测集成电路芯片在光接收侧具有光感测区域。 在光检测区域中布置有多个光感测装置，用于将入射光转换成电信号。 多个接合焊盘沿着光感测区域的一侧或两侧布置。 黑色密封胶不对称地涂在感光区域的郊区。 黑色密封胶具有至少两个涂层宽度。 玻璃盖用密封胶粘在感光区上。

公开(公告)号：US08766916B2

公开(公告)日：2014-07-01

申请号：US13527562

申请日：2012-06-19

Applicant: Chun-Yi Lu ,  Cheng-Kuang Sun ,  Yao-Hui Tseng ,  Horng-Goung Lai ,  Chao-Chien Huang ,  Meng-Huan Hsieh

Inventor： Chun-Yi Lu ,  Cheng-Kuang Sun ,  Yao-Hui Tseng ,  Horng-Goung Lai ,  Chao-Chien Huang ,  Meng-Huan Hsieh

IPC: G06F3/033 ,  G09G5/08

CPC classification number: G06F3/0325

Abstract: A pointing device includes two lenses with wide and narrow view angles respectively. In a short distance range, the pointing device utilizes the lens with wide view angle to increase visible range. In a long distance range, the pointing device utilizes the lens with narrow view angle to increase size of a formed image of a reference point. In addition, the pointing device senses images through both of the lenses with wide and narrow view angles to obtain rotational information. The pointing device can provide not only positional information but also angular information.

Abstract translation: 指示装置包括分别具有宽视角和窄视角的两个透镜。 在短距离范围内，指示装置利用具有宽视角的透镜来增加可见光范围。 在长距离范围内，指示装置利用具有窄视角的透镜来增加参考点的形成图像的尺寸。 此外，指示装置通过具有宽和窄视角的两个透镜感测图像以获得旋转信息。 指点装置不仅可以提供位置信息，还可以提供角度信息。

公开(公告)号：US07663693B2

公开(公告)日：2010-02-16

申请号：US10791410

申请日：2004-03-01

Applicant: Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

Inventor： Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/16225 ,  H04N2101/00 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract translation: 提供相机模块。 相机模块包括：透镜; 具有下部的保持器，保持器保持透镜; 电路板; 以及图像感知和处理单元，其包括层叠在图像感测装置上并与其电连接的图像感测装置和可选的信号处理装置，所述图像感测处理单元被封装在所述电路板的一侧上; 其中，所述保持器固定在所述电路板上，所述图像感测处理单元位于所述保持器的下部内部。 此外，如果电路板是柔性电路板，则可以在对应于图像感测和处理单元的柔性PCB的另一侧上设置硬板，以增强机械强度。