利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

23 条记录 (耗时 0.015 秒)

    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
    21.
    发明申请
    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink 审中-公开
    芯片与散热片之间的多路焊接热接口

    公开(公告)号：US20080274349A1

    公开(公告)日：2008-11-06

    申请号：US12172778

    申请日：2008-07-14

    申请人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    发明人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    IPC分类号： B32B5/16 ,  B23K1/20 ,  H05K7/20

    CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/14 ,  Y10T428/254 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

    摘要： The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface. When the second surface comprises a solderable surface, the particles will also bond to it. When the second surface is not solderable, a solder adhesion layer can be placed on it. The process also includes adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device such as a semiconductor device and the second surface can comprise a heat sink, such as a solderable heat sink. The invention also comprises a process for improving the heat conductivity of a TIM, an article of manufacture made by the process, and a composition of matter comprising the TIM.

    摘要翻译： 本发明包括用于接合第一表面和第二表面的方法，其中第一表面包括最初不可焊接的表面，其包括用焊料粘附层涂覆第一表面以在第一表面上产生焊料粘附层，并提供 一种热粘合材料（“TIM”）组合物，其包含可粘合的树脂基体中的可焊接导热颗粒，其中至少一些可焊接导热颗粒包含焊料表面。 TIM组合物被放置在第一表面和第二表面之间，以在第一表面上与第二表面和焊料粘附层两者之间延伸并与之邻接。 足够加热TIM组合物导致（a）将至少一些可焊接导热颗粒彼此焊接; 和（b）将至少一些可焊接导热颗粒焊接到第一表面上的焊料粘附层。 当第二表面包括可焊接表面时，颗粒也将结合到其上。 当第二表面不可焊接时，可以在其上放置焊料粘附层。 该方法还包括将树脂基体粘合到第一表面和第二表面上。 第一表面可以包括诸如半导体器件的电子器件，并且第二表面可以包括诸如可焊接散热器的散热器。 本发明还包括用于改善TIM的导热性，由该方法制造的制品以及包含该TIM的物质组成的方法。

    Transmissive liquid crystal cell with trench capacitor
    22.
    发明授权
    Transmissive liquid crystal cell with trench capacitor 失效
    带沟槽电容器的透射式液晶单元

    公开(公告)号：US6014189A

    公开(公告)日：2000-01-11

    申请号：US749746

    申请日：1996-11-15

    申请人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    发明人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    IPC分类号： G02F1/1362 ,  G02F1/1343

    CPC分类号： G02F1/136213 ,  G02F1/136286

    摘要： An apparatus and method for providing a display cell structure based on the transmissive liquid crystal technology with a useful aperture ratio even as the cell size shrinks to less than 20 microns. The invention overcomes a problem of the prior art wherein the fractional area transmitting the light of the conventional designs becomes unacceptably low due to the aperture reducing opaque storage capacitor. This reduction in aperture ratio is removed in this invention by hiding the trench capacitor below the row and column x,y lines. The cell storage capacitor is formed using a vertical trench capacitor in SOI. Although useful even in standard display sizes and configurations, the invention is particularly useful for head-mounted displays and/or optical projection displays at the UXGA form factor for both monochromatic and color displays. Alternate capacitor configurations are described.

    摘要翻译： 一种用于提供基于透射型液晶技术的显示单元结构的装置和方法，其具有有用孔径比，即使单元尺寸缩小到小于20微米。 本发明克服了现有技术的问题，其中透射传统设计的光的分数区域由于减小不透明存储电容器的孔径而变得不可接受地低。 在本发明中通过将沟槽电容器隐藏在行和列x，y线下方来消除开口率的减小。 在SOI中使用垂直沟槽电容器形成电池存储电容器。 尽管在标准显示器尺寸和配置中也是有用的，但本发明对于单色和彩色显示器的UXGA外形尺寸下的头戴式显示器和/或光学投影显示器特别有用。 描述备用电容器配置。