Self deploying magnifier for a portable computer display screen
    4.
    发明授权
    Self deploying magnifier for a portable computer display screen 失效
    用于便携式计算机显示屏幕的自我展开放大镜

    公开(公告)号:US5991150A

    公开(公告)日:1999-11-23

    申请号:US926176

    申请日:1997-09-09

    IPC分类号: G06F1/16 H05K7/16

    CPC分类号: G06F1/1609 G06F2200/1613

    摘要: The invention makes the size of the apparent image of the display screen of the display screen larger than the real size. A flat optical magnifier such as a lens of the fresnel type is positioned in an optically enhancing location between the operator and the display screen so that the apparent image at the operator side of the magnifier is greater than the actual image that is present on the display screen. A mechanism is provided for a notebook type portable computer that is passive to a user, folds into the case when the display screen closes over the keyboard and positions a fresnel lens, coplanar with and at a fixed distance from the display screen, when the notebook computer is opened and remains at that fixed distance as the display screen moves to maximum travel.

    摘要翻译: 本发明使得显示屏的显示屏的视觉图像的尺寸大于实际尺寸。 诸如菲涅耳型透镜的平面光学放大镜位于操作者和显示屏之间的光学增强位置,使得放大镜的操作者侧的视觉图像大于存在于显示器上的实际图像 屏幕。 提供了一种用于对用户无源的笔记本型便携式计算机的机构,折叠到当显示屏幕在键盘上关闭的情况下,并且当笔记本计算机在与笔记本电脑 计算机打开并保持在固定的距离,因为显示屏移动到最大行程。

    Method and apparatus for integrating microlens array into a liquid
crystal display device using a sacrificial substrate
    5.
    发明授权
    Method and apparatus for integrating microlens array into a liquid crystal display device using a sacrificial substrate 失效
    使用牺牲基板将微透镜阵列集成到液晶显示装置中的方法和装置

    公开(公告)号:US5929962A

    公开(公告)日:1999-07-27

    申请号:US17867

    申请日:1998-02-03

    CPC分类号: G02F1/133526

    摘要: A method and apparatus is presented for transmissive liquid crystal display devices with increased apparent aperture ratios. The aperture ratio is increased by focusing light into the transparent area using a microlens array on a per pixel basis. The method includes the steps of forming a top substrate having a sacrificial substrate adhered to a first transmissive substrate, a transmissive electrode layer adhered to the first transmissive substrate in which a plurality of color filters are disposed, the top substrate further having a rubbing layer formed proximate to the transmissive electrode layer. Forming a bottom substrate comprising a second transmissive substrate and a thin film transistor array disposed within the second transmissive substrate. Disposing a sealing material on one of the top or bottom substrates so as to form an outline of display. Aligning and assembling the top and bottom substrates together such that the sealing material is sandwiched between the top and bottom substrates which are maintained at a constant separation of a few microns uniformly across the display with the help of spacer balls or posts and the rubbing layer is proximate to the thin film transistor array. Releasing the sacrificial substrate from the first transmissive substrate and adhering a microlens array to the first transmissive substrate. Lastly, filling the outline of sealing material with liquid crystal material and sealing the liquid crystal material. Also provided is an apparatus for carrying out the method of the present invention.

    摘要翻译: 本发明提供了一种具有增加的视在孔径比的透射型液晶显示装置的方法和装置。 通过在每像素的基础上使用微透镜阵列将光聚焦到透明区域来增加孔径比。 该方法包括以下步骤:形成具有粘附到第一透射基板的牺牲基板的顶部基板,附着到其上设置有多个滤色器的第一透射基板的透射电极层,顶部基板还具有形成的摩擦层 靠近透射电极层。 形成底部衬底,其包括第二透射衬底和设置在第二透射衬底内的薄膜晶体管阵列。 在一个顶部或底部基板上设置密封材料,以形成显示器的轮廓。 将顶部和底部基底对准和组装在一起,使得密封材料夹在顶部和底部基底之间,借助于间隔球或支柱将它们保持在跨越显示器的几微米的恒定分离,并且摩擦层是 靠近薄膜晶体管阵列。 从第一透射衬底上释放牺牲衬底并将微透镜阵列粘附到第一透射衬底上。 最后,用液晶材料填充密封材料的轮廓并密封液晶材料。 还提供了一种用于实施本发明的方法的装置。

    Portable computer stand for enhanced cooling
    6.
    发明授权
    Portable computer stand for enhanced cooling 失效
    便携式电脑支架,用于增强散热

    公开(公告)号:US06414842B1

    公开(公告)日:2002-07-02

    申请号:US09543702

    申请日:2000-04-05

    IPC分类号: G06F120

    摘要: A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

    摘要翻译: 一种用于便携式个人计算机的支架,其包括具有前侧,后侧,右侧,左侧和底面的底座。 支架包括至少一个可与基座互连的支架构件。 至少一个支架构件可定位在展开位置和收起位置。 在展开位置中,至少一个支架构件相对于便携式个人计算机支撑的表面以升高的水平面支撑底座的底表面的至少一部分。 所述至少一个支架构件在所述收起位置中接合所述基座的表面。

    Computer bottom keyboard incorporating arrangement for enhanced cooling
    9.
    发明授权
    Computer bottom keyboard incorporating arrangement for enhanced cooling 失效
    电脑底部键盘结合了增强冷却的布置

    公开(公告)号:US5978215A

    公开(公告)日:1999-11-02

    申请号:US902703

    申请日:1997-07-30

    IPC分类号: G06F1/16 G06F1/20

    摘要: An arrangement and method for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and wherein at least portions of the computer electronics are housed in outwardly swivable or slidable compartment structure located above the keyboard so as to provide increased surface areas for dissipation of heat.

    摘要翻译: 一种用于增加便携式个人计算机(特别是笔记本电脑或笔记本电脑)的冷却能力的装置和方法,其中计算机具有键盘,其后缘与可打开的显示单元或面板的底部铰接连接,并且其中至少 计算机电子设备的部分容纳在位于键盘上方的可向外或可滑动的隔室结构中,以便提供增加的用于散热的表面积。

    System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
    10.
    发明授权
    System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face 有权
    在半导体或电介质晶片上制造的封装的系统,其一面上具有布线,延伸穿过晶片的通孔以及相对面上的外部连接

    公开(公告)号:US06593644B2

    公开(公告)日:2003-07-15

    申请号:US09838725

    申请日:2001-04-19

    IPC分类号: H01L23492

    摘要: A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitry is mounted, and external signal and power circuitry is contacted through the opposite face. Use of a substrate such as silicon permits the use of conventional silicon processes available in the art for providing high wiring density together with matching of the thermal expansion coefficient of any silicon chips in the integrated circuits. The use of vias through the substrate allows a high density of connections leaving the silicon substrate and provides short paths for the connections of power and signals.

    摘要翻译: 具有导电通孔的半导体或介电晶片用作集成电路封装结构中的基板,其中高密度片间和芯片间接触和布线位于其上安装集成电路的基板面上,以及外部信号和电源电路 通过相对面接触。 使用诸如硅的衬底允许使用本领域可获得的常规硅工艺来提供高布线密度以及集成电路中任何硅芯片的热膨胀系数的匹配。 使用通过基板的通孔允许离开硅衬底的高密度连接并且为功率和信号的连接提供短路径。