System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
    1.
    发明授权
    System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face 有权
    在半导体或电介质晶片上制造的封装的系统,其一面上具有布线,延伸穿过晶片的通孔以及相对面上的外部连接

    公开(公告)号:US06593644B2

    公开(公告)日:2003-07-15

    申请号:US09838725

    申请日:2001-04-19

    IPC分类号: H01L23492

    摘要: A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitry is mounted, and external signal and power circuitry is contacted through the opposite face. Use of a substrate such as silicon permits the use of conventional silicon processes available in the art for providing high wiring density together with matching of the thermal expansion coefficient of any silicon chips in the integrated circuits. The use of vias through the substrate allows a high density of connections leaving the silicon substrate and provides short paths for the connections of power and signals.

    摘要翻译: 具有导电通孔的半导体或介电晶片用作集成电路封装结构中的基板,其中高密度片间和芯片间接触和布线位于其上安装集成电路的基板面上,以及外部信号和电源电路 通过相对面接触。 使用诸如硅的衬底允许使用本领域可获得的常规硅工艺来提供高布线密度以及集成电路中任何硅芯片的热膨胀系数的匹配。 使用通过基板的通孔允许离开硅衬底的高密度连接并且为功率和信号的连接提供短路径。

    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
    2.
    发明申请
    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink 有权
    芯片与散热片之间的多路焊接热接口

    公开(公告)号:US20120006885A1

    公开(公告)日:2012-01-12

    申请号:US13226681

    申请日:2011-09-07

    IPC分类号: B23K1/20

    摘要: A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

    摘要翻译: 具有改善的导热性的物质的热界面材料(“TIM”)组合物包括可粘合树脂基质中的可焊接导热颗粒,并且至少一些可焊接导热颗粒包含焊料表面。 将TIM定位在具有焊料粘附层的第一表面和第二表面之间,然后加热导致将一些可焊接的导热颗粒彼此焊接; 还有一些与第一表面上的焊料粘附层,以及将树脂基体粘合到第一表面和第二表面上。 第一表面可以包括电子器件,例如半导体器件,第二表面可以包括诸如可焊接散热器的散热器。 产品包括通过该方法制造的制品。

    Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof
    3.
    发明授权
    Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof 失效
    电连接器设计和接触几何及其使用方法及其制造方法

    公开(公告)号:US07172431B2

    公开(公告)日:2007-02-06

    申请号:US10928473

    申请日:2004-08-27

    IPC分类号: H01R12/00

    摘要: A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.

    摘要翻译: 探针或电连接器包括具有多个电接触位置的表面的基底。 成形细长的电导体具有联接到电接触位置之一的第一端和其第二端,其突出远离电接触位置并穿过材料片中的孔。 片材被设置成与衬底的表面间隔开。 在细长电导体的第二端,有一个尖端结构,其大于该材料片中的孔。 尖端结构具有其尖端部分。 尖端结构设置成抵靠接触表面的接触位置。 电子结构朝向接触表面移动,允许尖端结构穿过其中的电接触位置的表面并且随着成形细长电导体由于被...的压缩而弯曲而在其表面上移动,擦拭或振动 电子结构向接触表面移动。

    Portable computer stand for enhanced cooling
    4.
    发明授权
    Portable computer stand for enhanced cooling 失效
    便携式电脑支架,用于增强散热

    公开(公告)号:US06414842B1

    公开(公告)日:2002-07-02

    申请号:US09543702

    申请日:2000-04-05

    IPC分类号: G06F120

    摘要: A stand for a portable personal computer including a base including a front side, a back side, a right side, a left side, and a bottom surface. The stand includes at least one stand member interconnectable with the base. The at least one stand member is positionable in a deployed position and a stowed position. In the deployed position the at least one stand member supports at least one portion of the bottom surface of the base at an elevated level with respect to a surface that the portable personal computer is supported by. The at least one stand member engages a surface of the base in the stowed position.

    摘要翻译: 一种用于便携式个人计算机的支架,其包括具有前侧,后侧,右侧,左侧和底面的底座。 支架包括至少一个可与基座互连的支架构件。 至少一个支架构件可定位在展开位置和收起位置。 在展开位置中,至少一个支架构件相对于便携式个人计算机支撑的表面以升高的水平面支撑底座的底表面的至少一部分。 所述至少一个支架构件在所述收起位置中接合所述基座的表面。

    Transmissive cell for ultra small pixel applications
    8.
    发明授权
    Transmissive cell for ultra small pixel applications 失效
    用于超小像素应用的透射单元

    公开(公告)号:US5999234A

    公开(公告)日:1999-12-07

    申请号:US834183

    申请日:1997-04-15

    摘要: A method and structure is presented for a display with reduced size pixels while retaining the transmissive approach. This enables continued use the least expensive transmission optics available. In an embodiment, it employs back-end-of-the-line vertical cells built on top of the row and column x, y lines of the pixels. In a PDLC type display embodiment each vertical cell is filled with PDLC which operates in a normally black mode known as the PDLC reverse mode. When the pixel control voltage is set ON, the liquid crystal is perpendicular to the light path resulting in a light pass through providing a bright state. When the control voltage is set OFF, the liquid crystals are randomly oriented, only the scattered light goes through the cell, so the pixel is in its OFF state. PDLC used here has two advantages. Firstly, the PDLC requires no rubbing. It is difficult to rub individual cell walls. Secondly, the use of both polarizations by the PDLC increases its luminous efficiency. Various embodiments are described for implementing vertical active electrodes and common ground electrodes. Advantages are described for employing the vertical electrodes with various implementations of a hidden storage capacitor.

    摘要翻译: 为保持透射方式的像素尺寸减小的显示器提供了一种方法和结构。 这使得可以继续使用可用的最便宜的传输光学器件。 在一个实施例中,它使用构建在像素的行和列x,y行的顶部上的后端行垂直单元。 在PDLC型显示实施例中,每个垂直单元填充有PDLC,PDLC以常规黑模式工作,称为PDLC反向模式。 当像素控制电压设置为ON时,液晶垂直于光路,导致光通过,提供亮状态。 当控制电压设定为OFF时,液晶随机取向,只有散射光通过电池,因此像素处于关闭状态。 这里使用的PDLC有两个优点。 首先,PDLC不需要摩擦。 难以擦拭单个细胞壁。 其次,通过PDLC的两极化的使用增加了发光效率。 描述了用于实现垂直有源电极和公共接地电极的各种实施例。 描述了采用具有隐藏存储电容器的各种实施方式的垂直电极的优点。

    Self deploying magnifier for a portable computer display screen
    9.
    发明授权
    Self deploying magnifier for a portable computer display screen 失效
    用于便携式计算机显示屏幕的自我展开放大镜

    公开(公告)号:US5991150A

    公开(公告)日:1999-11-23

    申请号:US926176

    申请日:1997-09-09

    IPC分类号: G06F1/16 H05K7/16

    CPC分类号: G06F1/1609 G06F2200/1613

    摘要: The invention makes the size of the apparent image of the display screen of the display screen larger than the real size. A flat optical magnifier such as a lens of the fresnel type is positioned in an optically enhancing location between the operator and the display screen so that the apparent image at the operator side of the magnifier is greater than the actual image that is present on the display screen. A mechanism is provided for a notebook type portable computer that is passive to a user, folds into the case when the display screen closes over the keyboard and positions a fresnel lens, coplanar with and at a fixed distance from the display screen, when the notebook computer is opened and remains at that fixed distance as the display screen moves to maximum travel.

    摘要翻译: 本发明使得显示屏的显示屏的视觉图像的尺寸大于实际尺寸。 诸如菲涅耳型透镜的平面光学放大镜位于操作者和显示屏之间的光学增强位置,使得放大镜的操作者侧的视觉图像大于存在于显示器上的实际图像 屏幕。 提供了一种用于对用户无源的笔记本型便携式计算机的机构,折叠到当显示屏幕在键盘上关闭的情况下,并且当笔记本计算机在与笔记本电脑 计算机打开并保持在固定的距离,因为显示屏移动到最大行程。

    Computer bottom keyboard incorporating arrangement for enhanced cooling
    10.
    发明授权
    Computer bottom keyboard incorporating arrangement for enhanced cooling 失效
    电脑底部键盘结合了增强冷却的布置

    公开(公告)号:US5978215A

    公开(公告)日:1999-11-02

    申请号:US902703

    申请日:1997-07-30

    IPC分类号: G06F1/16 G06F1/20

    摘要: An arrangement and method for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and wherein at least portions of the computer electronics are housed in outwardly swivable or slidable compartment structure located above the keyboard so as to provide increased surface areas for dissipation of heat.

    摘要翻译: 一种用于增加便携式个人计算机(特别是笔记本电脑或笔记本电脑)的冷却能力的装置和方法,其中计算机具有键盘,其后缘与可打开的显示单元或面板的底部铰接连接,并且其中至少 计算机电子设备的部分容纳在位于键盘上方的可向外或可滑动的隔室结构中,以便提供增加的用于散热的表面积。