Abstract:
The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.
Abstract:
A controlled area network (CAN) driver provides improved symmetry between its differential output signals CAN-H and CAN-L, and provides protection for its low voltage devices from voltage transients occurring on its output lines. A plurality of CAN drivers 80 are serially interconnected to form a driver system, wherein each downstream driver stage receives a time-delayed form of the digital input signal TxD, each stage providing a time-delayed contribution to the differential output signals of the overall driver system.
Abstract:
The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.
Abstract:
In accordance with the present invention, an output current limit circuit for protecting a power MOS output device of an integrated circuit from an excessive drain current comprises a power MOS device 110, a means 30 to sense a predetermined trigger current, and a means 20 to reduce a gate-source voltage on MOS output device 110 to a predetermined approximately fixed value. A drain current I.sub.D flows through power MOS device 110 from output terminal 102 in response to the gate-source voltage. A short circuit condition may allow an excessive amount of drain current I.sub.D to flow through output terminal 102. The gate-source voltage is reduced in response to sensing the trigger current. Reducing the gate-source voltage raises a drain-source resistance of MOS device 110 and reduces drain current I.sub.D so that MOS device 110 is not damaged by the short circuit condition.
Abstract:
An integrated power device comprises a power transistor (26) and a plurality of sense transistors (38), (40), (42), (44), and (46). Sense transistors (38), (40), (42), and (44) are constructed around the periphery of the active area occupied by power transistor (26). Sense transistor (46) is located within the interior of the active area occupied by power transistor (26) and contact is made to the necessary source region (64) of transistor (46) using a second level of metal interconnect to form a source contact (74).