摘要:
A solid state image sensing device, comprises: an n-type semiconductor substrate (11), a p-type well (12) formed on a surface of the semiconductor substrate, and a p.sup.+ -type diffusion layer (13, 21) having an impurity concentration higher than that of the well. In particular, the P.sup.+ -type diffusion layer (13) is formed so as to cover at least a part of circumference of an n-type diffusion layer (17) of a load transistor (N3) formed in the well (12) as a source follower circuit. Instead, the P.sup.+ -type diffusion layer (21) is formed between the n-type diffusion layer (17) of the load transistor (N3) and the semiconductor substrate (11). In both the cases, since the n-type diffusion layer (17) of the load transistor (N3) of the source follower circuit is covered with the second conductivity diffusion layer (13, 21) higher in impurity concentration than that of the well, even when a pulse is applied to the semiconductor substrate during electronic shutter operation, the p-type well (12) is not depleted, so that it is possible to prevent punch through current (I) from flowing from the n-type diffusion layer (17) of the load transistor (N3) to the n-type substrate (11).
摘要:
Solid-state image sensing device is provided with a synthesizing section for synthesizing odd-field signal charges and even-field signal charges. The synthesizing section is a transfer path formed outside of the photosensitive region or vertical transfer paths formed in the photosensitive region. For the signal charge synthesis through vertical transfer path, after the integration, the signal charges are read simultaneously from the odd-line pixel group and the even-line pixel group. Further, it is possible to select either the method of outputting the odd-field signal charges and the even-field signal charges separately or the method of outputting the synthesized odd- and even-field signal charges.
摘要:
A solid-state image sensing device comprises: a charge storage layer (12) formed in the vicinity of a surface of a first conductive type semiconductor substrate (11), for transferring incident light into an electric signal photoelectrically and further storing the transferred electric signal as a signal charge temporarily; a transfer channel (14) formed on the surface of the semiconductor substrate, for transferring the signal charge stored in the charge storing layer; a depletion prevention layer (13) formed on the surface of the semiconductor substrate and on the charge storage layer, for preventing interfaces from being depleted; and a barrier layer (16) formed at a position deeper than the transfer channel, for preventing punch through from being generated between the charge storage layer (12) and the transfer channel (14). The barrier layer (16) is formed locally at such a position that a maximum impurity concentration thereof is located at a position deeper than the depletion prevention layer. In the image sensing device, when the junction length between the barrier layer and the depletion prevention layer is shortened for miniaturization, it is possible to prevent the impurity concentration of the transfer channel from being lowered by the barrier layer, so that a drop of the transfer capacity of the transfer channel can be prevented, thus reducing the size of and increasing the number of pixels.