公开(公告)号：US20200335680A1

公开(公告)日：2020-10-22

申请号：US16904102

申请日：2020-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

公开(公告)号：US20200258762A1

公开(公告)日：2020-08-13

申请号：US16783013

申请日：2020-02-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: H01L21/67 ,  G05D23/01 ,  H01L21/768

Abstract: The present invention relates generally to a temperature control apparatus capable of controlling the temperature of a product using a temperature control material. More particularly, the present invention relates to a temperature control apparatus capable of uniformly controlling the temperature of a product by reducing a temperature deviation of a temperature control material flowing inside the product.

公开(公告)号：US20200070364A1

公开(公告)日：2020-03-05

申请号：US16551566

申请日：2019-08-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: B25J15/06 ,  B25J7/00

Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

公开(公告)号：US20200044127A1

公开(公告)日：2020-02-06

申请号：US16526702

申请日：2019-07-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/62

Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

公开(公告)号：US20200043771A1

公开(公告)日：2020-02-06

申请号：US16529407

申请日：2019-08-01

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/677 ,  H01L33/00 ,  H01L21/683

Abstract: The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

公开(公告)号：US10539526B2

公开(公告)日：2020-01-21

申请号：US15674463

申请日：2017-08-10

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12

Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.

公开(公告)号：US20190178862A1

公开(公告)日：2019-06-13

申请号：US16201891

申请日：2018-11-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N33/00 ,  G01N21/88

Abstract: The present invention relates to an air quality measuring apparatus. The air quality measuring apparatus measures air quality using air flow generated therein using a variable and restorable pumping means, thereby reducing power consumption and a volume of the air quality measuring apparatus so as to be portable.

公开(公告)号：US10128414B2

公开(公告)日：2018-11-13

申请号：US14985275

申请日：2015-12-30

Applicant: Point Engineering Co., Ltd.

Inventor： Seung Ho Park ,  Tae Hwan Song

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/64

Abstract: A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.

公开(公告)号：US10015841B2

公开(公告)日：2018-07-03

申请号：US14864184

申请日：2015-09-24

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  H05B3/03 ,  H05B3/26

CPC classification number: H05B3/03 ,  G01N27/12 ,  H05B3/262 ,  H05B2203/014 ,  H05B2203/017

Abstract: A micro heater and a micro sensor is capable of providing a heater having a small thermal capacity by forming an air gap which surrounds the heater wire, and forming the heater wire on a porous substrate.

公开(公告)号：US20170309868A1

公开(公告)日：2017-10-26

申请号：US15491351

申请日：2017-04-19

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L51/56 ,  H01L51/00 ,  H01L51/50

CPC classification number: H01L51/56 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  C25D11/04 ,  C25D11/20 ,  C25D11/24 ,  H01L51/0011 ,  H01L51/5012

Abstract: A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.