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公开(公告)号：US20240319471A1
公开(公告)日：2024-09-26
申请号：US18734764
申请日：2024-06-05
发明人： Young Hwan KWON , Kum Kyung LEE , Nam Ki PARK , Ta Kyoung LEE , Jung Seok LEE , Young Bok YOON , Dong Yeon SHIN
CPC分类号： G02B7/021 , G02B7/102 , G02B27/646 , G03B5/00 , G03B13/36 , G02B13/0065 , G02B17/023
摘要： A camera module includes a housing; a plurality of movable lens modules disposed in an internal space of the housing and configured to be movable in an optical axis direction, each of the plurality of movable lens modules comprising at least one lens; and a stopper configured to prevent contact between at least two of the plurality of movable lens modules, wherein the stopper includes a frame mounted on the housing; an extension portion extending from the frame into the internal space of the housing to face a side of one movable lens module of the plurality of movable lens modules in the optical axis direction; and a damping member disposed on the extension portion to face the side of the one movable lens module in the optical axis direction.
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公开(公告)号：US12101890B2
公开(公告)日：2024-09-24
申请号：US17850156
申请日：2022-06-27
发明人： Myung Ju Gi , Young Ii Cho
CPC分类号： H05K3/0017 , H05K3/188 , H05K2203/0323 , H05K2203/163
摘要： A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductive layer and the intermediate layer. After the etching, a surface of the second conductive layer protrudes further than a surface of the second insulating layer. The intermediate layer before the etching includes a portion overlapping the second conductive layer in a vertical direction and another portion not overlapping the second conductive layer in the vertical direction.
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公开(公告)号：US12100802B2
公开(公告)日：2024-09-24
申请号：US17470248
申请日：2021-09-09
发明人： Jung Eun Noh , Soo Young Ji
IPC分类号： H01M10/0562 , H01M4/02 , H01M4/525 , H01M4/66 , H01M4/80 , H01M10/0525 , H01M50/54 , H01M50/562
CPC分类号： H01M10/0562 , H01M4/525 , H01M4/661 , H01M4/80 , H01M10/0525 , H01M50/54 , H01M50/562 , H01M2004/021 , H01M2004/027 , H01M2004/028
摘要： An all solid state battery includes: a battery body including an electrode assembly having first and second surfaces in a first direction, third and fourth surfaces in a second direction, and fifth and sixth surfaces in a third direction, and including a solid electrolyte layer and a cathode and an anode; a first connection portion; and a second connection portion disposed on the electrode assembly. The first connection portion includes a first current collecting electrode and a first protection portion, the second connection portion includes a second current collecting electrode and a second protection portion, and the first current collecting electrode is drawn out to one surface of the first connection portion in the third direction and the second current collecting electrode is drawn out to one surface of the second connection portion in the third direction.
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公开(公告)号：US20240313092A1
公开(公告)日：2024-09-19
申请号：US18410355
申请日：2024-01-11
发明人： Donghyeon LEE , Kyungmoon JUNG
IPC分类号： H01L29/73 , H01L27/082 , H01L29/08 , H03F3/213
CPC分类号： H01L29/7302 , H01L27/082 , H01L29/0804 , H01L29/0821 , H03F3/213
摘要： A semiconductor device including a plurality of unit transistors, each of which is disposed on a semiconductor substrate and includes a collector electrode configured to output an output signal, a base electrode configured to receive an input signal, and an emitter electrode; and an emitter junction wiring interconnecting emitter electrodes of the plurality of unit transistors. In a thickness direction of the semiconductor substrate, a portion of the emitter junction wiring positioned between at least two unit transistors adjacent to each other among the plurality of unit transistors and another portion of the emitter junction wiring positioned outside of the two unit transistors have different thicknesses.
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公开(公告)号：US20240312715A1
公开(公告)日：2024-09-19
申请号：US18583228
申请日：2024-02-21
发明人： Doyoung Jeong , Jeongmo Kang , Inkyung Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： Disclosed is multilayered capacitor that includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the external electrode includes a metal layer having surface roughness disposed outside the capacitor body and including a first conductive metal, and a conductive resin layer including a resin and a second conductive metal.
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公开(公告)号：US20240312706A1
公开(公告)日：2024-09-19
申请号：US18530856
申请日：2023-12-06
发明人： Beomjoon Cho
CPC分类号： H01G2/065 , H01G4/012 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayered capacitor including a capacitor body and an external electrode disposed on one surface of the capacitor body, a frame terminal mounting the multilayered capacitor on a board, and a conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion including a second material, and a coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the conductive bonding portion.
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公开(公告)号：US20240310608A1
公开(公告)日：2024-09-19
申请号：US18671377
申请日：2024-05-22
发明人： Ho Sik YOO , Dong Shin YANG , Yong Joo JO , Sot Eum SEO
CPC分类号： G02B13/0045 , G02B9/64
摘要： An optical imaging system includes: a first lens having a concave image-side surface; a second lens having refractive power; a third lens having a concave image-side surface; a fourth lens having a concave object-side surface or a convex image-side surface; a fifth lens having refractive power; a sixth lens having a concave image-side surface; and a seventh lens having negative refractive power. The first to seventh lenses are sequentially disposed from an object side and 1.62
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公开(公告)号：US20240306292A1
公开(公告)日：2024-09-12
申请号：US18388302
申请日：2023-11-09
发明人： Kyehwan Lee
CPC分类号： H05K1/0306 , H05K1/056 , H05K1/111 , H05K3/244 , H05K3/287
摘要： A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
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公开(公告)号：US20240304391A1
公开(公告)日：2024-09-12
申请号：US18235065
申请日：2023-08-17
发明人： Myungwoo Lee , Haesol Jung , Wonsik Jeong , Sungsoo Choi , Won Woo Lee , Gunhwan Ryu
IPC分类号： H01G4/30 , C04B35/468 , C04B35/64 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , C04B35/4682 , C04B35/64 , H01G4/012 , H01G4/1227
摘要： A multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the dielectric layer includes a plurality of dielectric crystal grains, the dielectric crystal grains include Bax(Ti1-yZry)O3 as a main component and satisfy 0
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公开(公告)号：US20240304385A1
公开(公告)日：2024-09-12
申请号：US18224670
申请日：2023-07-21
发明人： Sin Il GU , Jin Hyung LIM
摘要： A multilayer electronic component includes a body including first and second surfaces facing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and including a capacitance forming portion including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a lower cover portion disposed between the first surface and the capacitance forming portion, and an upper cover portion disposed between the second surface and the capacitance forming portion, a first external electrode disposed on the third surface, and a second external electrode disposed on the fourth surface, wherein, among the upper cover portion and the lower cover portion, only the upper cover portion includes a buffer electrode.
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