公开(公告)号：US20250168207A1

公开(公告)日：2025-05-22

申请号：US19034389

申请日：2025-01-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongin LEE ,  Sehyun KIM ,  Yongwoo SHIN ,  Kilsoo CHOI ,  Hyeeun PARK

IPC: H04L65/1093 ,  G06F3/0481 ,  G06F3/0484

Abstract: An electronic device capable of providing a video call service and a control method for same. The electronic device comprises a memory, a transceiver, and a processor electrically connectable to the memory and transceiver. The processor: provides a user interface in association with a video call application on a display, the user interface including a first video received from a camera, a second video received from the transceiver, and an option enabled to trigger transmission of second system information; and, based on detection of a preset triggering condition, switches the user interface which is a first user interface to a second user interface that excludes the option enabling trigger transmission. The first system information and the second system information are determined on the basis of configuration information associated with a preview representation of the video call application.

公开(公告)号：US20250168042A1

公开(公告)日：2025-05-22

申请号：US19035176

申请日：2025-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongbae HAN ,  Jaemin JUNG ,  Kyungsik MIN

IPC: H04L25/02 ,  H04B7/06 ,  H04L5/00

Abstract: A method performed by a radio unit (RU) is provided. The method includes receiving, by the RU, sounding reference signals (SRSs), receiving, by the RU from a distributed unit (DU) via a fronthaul interface, a control plane (C-plane) message including SRS configuration information, performing, by the RU, channel estimation based on the SRSs and the SRS configuration information, and performing, by the RU, beamforming on the basis of the channel estimation.

公开(公告)号：US20250167954A1

公开(公告)日：2025-05-22

申请号：US18730651

申请日：2023-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongmok LIM ,  Kyoungmin PARK ,  Ameha Tsegaye ABEBE ,  Youngrok JANG ,  Hyoungju JI

IPC: H04L5/00 ,  H04B7/06

Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. The present disclosure relates to: a communication technique merging IoT technology with a 5G communication system for supporting a data transmission rate higher than that of a 4G system; and a system therefor. The present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, small business, security- and safety-related services, and the like) on the basis of 5G communication technology and IoT-related technology. According to various embodiments of the present disclosure, a method performed by a base station in a wireless communication system comprises the steps of: receiving terminal capability report information from a terminal; transmitting, to the terminal, an upper layer parameter determined on the basis of the terminal capability report information; receiving, from the terminal, a sounding reference signal (SRS) determined by means of the upper layer parameter; determining downlink control information (DCI) for scheduling a physical uplink shared channel (PUSCH) on the basis of the SRS; transmitting a signal including the DCI to the terminal; and receiving the PUSCH and an uplink (UL) phase tracking reference signal (PTRS) from the terminal.

公开(公告)号：US20250167946A1

公开(公告)日：2025-05-22

申请号：US18841567

申请日：2023-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongmok LIM ,  Kyoungmin PARK ,  Youngrok JANG ,  Ameha Tsegaye ABEBE ,  Hyoungju JI

IPC: H04L5/00 ,  H04W72/0446

Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. According to various embodiments of the present disclosure, a method performed by a UE in a wireless communication system may comprise the steps of: receiving, from a base station, configuration information for one or more physical uplink control channel (PUCCH) resources indicating at least one transmission configuration indicator (TCI) state, and information about a TCI state application time; receiving, from the base station, first downlink control information (DCI) including information indicating first one or more TCI states, receiving, from the base station, second DCI including information indicating second one or more TCI states and an indicator for at least one PUCCH resource, and scheduling a PUCCH; and transmitting the PUCCH to the base station on the basis of the first DCI, the second DCI, and the TCI state application time.

公开(公告)号：US20250167876A1

公开(公告)日：2025-05-22

申请号：US18838969

申请日：2023-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mahmoud WATFA ,  Chadi KHIRALLAH ,  Lalith KUMAR

IPC: H04B7/185 ,  H04L69/28 ,  H04W48/16

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Disclosed is a method of operating a User Equipment, UE, the UE communicating with a telecommunication network via a satellite, wherein when a Non-Access Stratum, NAS, timer is determined, any restriction on use of an enhanced coverage indication from the telecommunication network is not considered when the NAS timer is determined.

公开(公告)号：US20250167875A1

公开(公告)日：2025-05-22

申请号：US18841581

申请日：2023-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Zhe CHEN ,  Bin YU ,  Feifei SUN

IPC: H04B7/155 ,  H04L5/00

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. The disclosure provides a method and a device for receiving and transmitting information. Specifically, method and device according to the present disclosure discloses a method performed by a repeater in a wireless communication network, which comprises: receiving reference signal information from a base station; and receiving signal and/or forwarding signal in time domain resources related to at least one of the reference signals, wherein at least one of the reference signals is related to the reference signal information. Further disclosed a method performed by a repeater in a wireless communication network, which comprises: receiving time domain resource information from a base station; and receiving signal and/or forwarding signal in at least one of the time domain resources, wherein at least one of the time domain resources is related to the time domain resource information.

公开(公告)号：US20250167816A1

公开(公告)日：2025-05-22

申请号：US18950445

申请日：2024-11-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heesung LEE ,  Jaekwang KWON ,  Dongki KIM ,  Seongkyun KIM ,  Hyohyun NAM ,  Kyeongho YEOM ,  Daeyoung LEE

IPC: H04B1/00 ,  H04B1/16

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a data transmission rate higher than a 4G communication system such as LTE. An electronic device in a wireless communication system may include a PA and an SM configured to supply power to the PA, wherein the SM may include a linear SM to which a signal for an envelope tracking (ET) is input, and a first SM connected to the linear SM and comprising a first converter for direct current (DC)-DC conversion and at least one lumped element connected to the first converter, and the first SM may be configured to convert the signal for the ET into a first digital signal, to generate a first control signal for the first converter based on a change of a voltage value of the first digital signal, to generate a second digital signal by delaying the first digital signal by a predetermined clock, and to control the at least one lumped element based on the first digital signal and the second digital signal to adjust a current output from the first SM.

公开(公告)号：US20250167193A1

公开(公告)日：2025-05-22

申请号：US18807904

申请日：2024-08-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin YANG ,  WooPoung KIM

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H10B12/00 ,  H10B80/00

Abstract: A method, system, and device are disclosed herein where a first layer includes at least one transistor, a second layer on a first side of the first layer includes a signal network, a third layer on a second side of the first layer, opposite the first side, includes a backside power delivery network, and a memory module is coupled to the signal network. The backside power delivery network, the at least one transistor, and the signal network may provide a logic circuit for the memory module.

公开(公告)号：US20250167156A1

公开(公告)日：2025-05-22

申请号：US19028917

申请日：2025-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Aenee Jang ,  Younglyong Kim

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip including a first substrate having first and second surfaces opposite to each other, a through electrode in the first substrate, a first chip pad on the first surface and electrically connected to the through electrode, and a second chip pad on the first surface and electrically connected to a circuit element in the first substrate; a redistribution wiring layer on the first surface of the first semiconductor chip, and including a first redistribution wiring line electrically connected to the first chip pad and a second redistribution wiring line electrically connected to the second chip pad; a second semiconductor chip stacked on the second surface of the first semiconductor chip and electrically connected to the through electrode; and a molding member on side surfaces of the first and second semiconductor chips.

公开(公告)号：US20250167144A1

公开(公告)日：2025-05-22

申请号：US18665324

申请日：2024-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Lee ,  JUHYEON KIM ,  SEUNGHOON YEON ,  SeungRyong Oh

IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: A semiconductor structure may include a first redistribution line, a first redistribution via that is positioned on the first redistribution line and has a width in the horizontal direction that decreases from a bottom end of the first redistribution via to a top end of the first redistribution via, a second redistribution line that is positioned on the first redistribution via, a dielectric that covers the first redistribution line, the first redistribution via, and the second redistribution line, and a first seed metal layer that is positioned between the lower surface of the first redistribution via and the first redistribution line, between the side surface of the first redistribution via and the dielectric, and between the lower surface of the second redistribution line and the dielectric.