Abstract:
A photoacoustic detection device including a nanophotonic circuit including a first chip on which is formed at least one optical waveguide and in which is formed a set of cavities defining a Helmholtz resonator; at least one optical source capable of emitting an optical signal in a given wavelength range, capable of being modulated at an acoustic modulation frequency, this source being attached to the first chip; a second chip forming a cap for said cavities and including acoustic sensors; and electronic circuits for processing the output of the acoustic sensors formed in the first or the second chip.
Abstract:
A heating mold for thermal nanoimprint lithography comprising resistive heating means and collecting means for collecting the electromagnetic energy of a variable electromagnetic field emitted by a source located outside the mold, said collecting means being connected to said resistive heating means (34) in which said energy is dissipated.Method for manufacturing this mold.A thermal nanoimprint lithography device comprising said mold.A method for preparing a substrate comprising a surface nanostructured by a thermal nanoimprint lithography technique, wherein said mold is applied.
Abstract:
Device for detecting a gas, comprising: excitation means, for exciting said gas by means of an electromagnetic wave having a wavelength corresponding approximately to that of said gas; and detection means, for detecting the excitation of said gas, characterized in that it comprises: a waveguide (1) connected to said excitation means, a part (11) of which forms a movable element designed to be in contact with said gas and capable of being set into vibration by the impact of the excited gas molecules; and a measurement sensor (4), for measuring the vibration of said element, said measurement sensor and said element forming said detection means.
Abstract:
A heating mould for thermal nanoimprint lithography, a process of producing the mould, and a process for producing a nanostructured substrate employing the mould. The heating mould includes a substrate having a first principal surface and a second principal surface, and a through-cavity extending from a first orifice in the first principal surface up to a second orifice in the second principal surface. The heating mould also includes a thermally conducting layer that mechanically supports the second membrane, an insulating layer beneath the thermally conducting mechanical support layer, heating means and an electrically and thermally insulating layer which covers the heating means and, at least partially, the second membrane, imprint patterns on the electrically and thermally insulating layer, and means for supplying an electric current to the heating means.