公开(公告)号：US20110181000A1

公开(公告)日：2011-07-28

申请号：US13079745

申请日：2011-04-04

Applicant: Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

Inventor： Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

IPC: F16J15/16

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/08

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract translation: 公开了一种在电镀系统在线时能够快速清洁的闭式电镀杯组件的实施例。 一个公开的实施例包括杯组件和锥形组件，其中杯组件包括杯底，其包括开口，围绕开口的密封件，包括围绕开口设置的多个电触点的电接触结构，以及内杯侧 其沿着杯的轴向方向从杯形顶部向杯底部向内渐缩。

公开(公告)号：US20090107836A1

公开(公告)日：2009-04-30

申请号：US11929638

申请日：2007-10-30

Applicant: Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

Inventor： Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

IPC: C25D17/06 ,  F16J15/34

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/02

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract translation: 公开了一种闭式电镀杯的实施例。 一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。 密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。 该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个接触件，并且其中每个接触件具有大致平坦的晶片接触表面。 该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。

公开(公告)号：US20090107835A1

公开(公告)日：2009-04-30

申请号：US11932595

申请日：2007-10-31

Applicant: Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

Inventor： Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

IPC: C25B9/00

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/08

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract translation: 公开了一种在电镀系统在线时能够快速清洁的闭式电镀杯组件的实施例。 一个公开的实施例包括杯组件和锥形组件，其中杯组件包括杯底，其包括开口，围绕开口的密封件，包括围绕开口设置的多个电触点的电接触结构，以及内杯侧 其沿着杯的轴向方向从杯形顶部向杯底部向内渐缩。