公开(公告)号：US5405896A

公开(公告)日：1995-04-11

申请号：US163556

申请日：1993-12-09

申请人： Hironao Fujiki ,  Shigeki Shudo ,  Akira Matsuda

发明人： Hironao Fujiki ,  Shigeki Shudo ,  Akira Matsuda

IPC分类号： C07F7/08 ,  C07F7/21 ,  C08K5/5419 ,  C08L83/04 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/07 ,  C08K5/24 ,  C08F8/00 ,  C08G77/06 ,  C08L83/00

CPC分类号： C08L83/04 ,  C07F7/0896 ,  C07F7/21 ,  C08K5/5419 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70

摘要： An adhesive silicone rubber composition of addition reaction curing type comprising (a) an organopolysiloxane containing an alkenyl group; (b) an organohydrogenpolysiloxane having at least one hydrogen atom directly attached to a silicon atom in a molecule; (c) an addition reaction catalyst; and (d) an adhesive agent selected from compounds of the following formulae (I), (II) and (III):A-(D-B).sub.x -D-A (I)C-(B-D).sub.x -B-C (II)A-E (III)wherein each of A and B is a silane or siloxane group, each group having at least one hydrogen atom directly attached to a silicon atom and an optional substituent which is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms attached to the same or different silicon atom, A being monovalent and B being divalent,each of C and D is a group having contained therein at least one member selected from the group consisting of a substituted or unsubstituted aryl group, a substituted or unsubstituted arylene group, ##STR1## and an optional substituent which is selected from alkyl or alkylene groups, C being monovalent and D being divalent,E is a monovalent group as defined for C, with the proviso that the total number of atoms in E other than hydrogen and halogen atoms is at least 8, andletter x is 0 or a positive number,said adhesive silicone rubber composition giving a cured product that does not adhere to metal.

摘要翻译： 一种加成反应固化型粘合性硅橡胶组合物，其包含（a）含有烯基的有机聚硅氧烷; （b）具有至少一个氢原子的有机氢聚硅氧烷，其直接连接到分子中的硅原子上; （c）加成反应催化剂; 和（d）选自下式（I），（II）和（III）的化合物的粘合剂：A-（DB）xDA（I）C-（BD）xBC（II）AE（III） 的A和B是硅烷或硅氧烷基团，每个基团具有至少一个与硅原子直接相连的氢原子和任选的取代基，其是具有1-8个碳原子的取代或未取代的一价烃基彼此相连或不同 硅原子，A为一价，B为二价，C和D各自为含有至少一个选自取代或未取代的芳基，取代或未取代的亚芳基，取代或未取代的亚芳基，和 选自烷基或亚烷基的任选的取代基，C为一价，D为二价，E为C定义的一价基团，条件是除氢和卤素原子以外的E中的原子总数至少为 8，字母x为0或正数， 所述粘合性硅橡胶组合物产生不粘附到金属上的固化产物。

公开(公告)号：US5335457A

公开(公告)日：1994-08-09

申请号：US966484

申请日：1992-10-26

申请人： Akira Matsuda ,  Shigeki Shudo ,  Noboru Shimamoto ,  Kohichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

发明人： Akira Matsuda ,  Shigeki Shudo ,  Noboru Shimamoto ,  Kohichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

IPC分类号： B24B37/04 ,  B24B37/30 ,  H01L21/304 ,  H01L21/683 ,  B24B7/22

CPC分类号： H01L21/6838

摘要： A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.

摘要翻译： 一种夹持半导体晶片的方法，其中在具有用于真空吸附的精细通孔的硬质基板的表面上形成具有高平坦度的硅氧烷弹性层。 在硅弹性层中的下一个细小的通孔中，每个通孔与硬质基底的细通孔相通。 接下来，半导体晶片通过从基板的背面真空夹持而保持在硬质基板上，以便仅在晶片抛光期间通过硅树脂弹性层的表面粘合将半导体晶片牢固地保持在基板上。 该方法不需要在抛光过程中将半导体晶片保持在硬表面上的蜡或类似的粘合剂，并且可以实现用于半导体晶片的高精度和高质量的表面抛光工艺。