Surface passivated photovoltaic devices
    22.
    发明申请
    Surface passivated photovoltaic devices 失效
    表面钝化光伏器件

    公开(公告)号:US20060255340A1

    公开(公告)日:2006-11-16

    申请号:US11127648

    申请日:2005-05-12

    IPC分类号: H01L33/00

    摘要: A photovoltaic device comprising a photovoltaic cell is provided. The photovoltaic cell includes an emitter layer comprising a crystalline semiconductor material and a lightly doped crystalline substrate disposed adjacent the emitter layer. The lightly doped crystalline substrate and the emitter layer are oppositely doped. Further, the photovoltaic device includes a back surface passivated structure coupled to the photovoltaic cell. The structure includes a highly doped back surface field layer disposed adjacent the lightly doped crystalline substrate. The highly doped back surface field layer includes an amorphous or a microcrystalline semiconductor material, wherein the highly doped back surface field layer and the lightly doped crystalline substrate are similarly doped, and wherein a doping level of the highly doped back surface field layer is higher than a doping level of the lightly doped crystalline substrate. Additionally, the structure may also include an intrinsic back surface passivated layer disposed adjacent the lightly doped crystalline substrate, where the intrinsic back surface passivated layer includes an amorphous or a microcrystalline semiconductor material.

    摘要翻译: 提供了包括光伏电池的光伏器件。 光伏电池包括包含晶体半导体材料的发射极层和邻近发射极层设置的轻掺杂晶体衬底。 轻掺杂的晶体衬底和发射极层是相反掺杂的。 此外,光伏器件包括耦合到光伏电池的背面钝化结构。 该结构包括邻近轻掺杂晶体衬底设置的高掺杂背表面场层。 高度掺杂的背表面场层包括非晶或微晶半导体材料,其中高度掺杂的背表面场层和轻掺杂的晶体衬底被类似地掺杂,并且其中高掺杂背表面场层的掺杂水平高于 掺杂水平的轻掺杂晶体衬底。 此外,该结构还可以包括邻近轻掺杂晶体衬底设置的本征背表面钝化层,其中本征背表面钝化层包括非晶或微晶半导体材料。

    Compositionally-graded photovoltaic device and fabrication method, and related articles
    28.
    发明申请
    Compositionally-graded photovoltaic device and fabrication method, and related articles 审中-公开
    成分级光伏器件及制造方法及相关文章

    公开(公告)号:US20070023081A1

    公开(公告)日:2007-02-01

    申请号:US11263159

    申请日:2005-10-31

    IPC分类号: H01L31/00 H02N6/00

    摘要: A semiconductor structure is described, including a semiconductor substrate of one conductivity type; and an amorphous semiconductor layer disposed on at least one of its surfaces. The amorphous semiconductor layer is compositionally graded through its depth, from substantially intrinsic at the interface with the substrate, to substantially conductive at the opposite side. Photovoltaic devices which include such a structure are also disclosed, as are solar modules made from one or more of the devices. Related methods are also described.

    摘要翻译: 描述了一种半导体结构,包括一种导电类型的半导体衬底; 以及设置在其至少一个表面上的非晶半导体层。 非晶半导体层在其与衬底的界面处的本质上在其深度上被组成分级,在相对侧基本上是导电的。 还公开了包括这种结构的光伏器件,以及由一个或多个器件制成的太阳能模块也是如此。 还描述了相关方法。

    Phosphor film, imaging assembly and inspection method
    30.
    发明申请
    Phosphor film, imaging assembly and inspection method 审中-公开
    荧光膜,成像组装及检验方法

    公开(公告)号:US20060214115A1

    公开(公告)日:2006-09-28

    申请号:US11088039

    申请日:2005-03-23

    IPC分类号: G01T1/00

    摘要: An adaptable imaging assembly is provided. The adaptable imaging assembly includes a free-standing phosphor film configured to receive incident radiation and to emit corresponding optical signals. An electronic device is coupled to the free-standing phosphor film. The electronic device is configured to receive the optical signals from the free-standing phosphor film and to generate an imaging signal. A free-standing phosphor film is also provided and includes x-ray phosphor particles dispersed in a silicone binder. A method for inspecting a component is also provided and includes exposing the component and a free-standing phosphor film to radiation, generating corresponding optical signals with the free standing phosphor film, receiving the optical signals with an electronic device coupled to the free-standing phosphor film and generating an imaging signal using the electronic device.

    摘要翻译: 提供了可适应的成像组件。 适应性成像组件包括独立荧光体膜,其被配置为接收入射辐射并发射相应的光信号。 电子设备耦合到独立荧光膜。 电子设备被配置为从独立荧光膜接收光信号并产生成像信号。 还提供了独立的荧光体膜,并且包括分散在硅酮粘合剂中的x射线荧光体颗粒。 还提供了用于检查部件的方法,包括将部件和独立的荧光体膜暴露于辐射,用自立式荧光膜产生相应的光信号,用与独立荧光体耦合的电子器件接收光信号 并使用该电子设备产生成像信号。