公开(公告)号：US10714894B1

公开(公告)日：2020-07-14

申请号：US15938398

申请日：2018-03-28

Applicant: ACACIA COMMUNICATIONS, INC.

Inventor： Christopher Doerr ,  Li Chen ,  Long Chen

IPC: H01S5/14 ,  H01S5/062 ,  H01S5/10 ,  H01S5/024 ,  H01S5/30 ,  H01S5/06

Abstract: In a first embodiment, an external cavity tunable laser, comprising a silicon photonics circuit comprising one or more resonators having one or more p-i-n junctions; wherein a voltage is applied to one or more of the p-i-n junctions. In a second embodiment, a method of operating an external cavity tunable laser, comprising sweeping out free-carriers from a resonator of the tunable laser by applying a voltage to a p-i-n junction of a waveguide of the resonator.

公开(公告)号：US10578799B2

公开(公告)日：2020-03-03

申请号：US15870468

申请日：2018-01-12

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/42

Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US10268055B1

公开(公告)日：2019-04-23

申请号：US16215717

申请日：2018-12-11

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  John Heanue ,  Momchil T. Mihnev

IPC: G02F1/01

Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

公开(公告)号：US10222566B1

公开(公告)日：2019-03-05

申请号：US14991242

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen

IPC: G02B6/42 ,  G02B6/30

Abstract: A photonic integrated circuit (PIC) coupled to a substrate may be aligned with receptacles having guide pin structures configured to receive guide pins attached to a fiber assembly. The receptacles may be affixed to a surface of the substrate and/or the PIC to permit the fiber assembly to be removed during a solder reflow process while maintaining the alignment of the fiber assembly to the PIC when reconnected following the solder reflow process.

公开(公告)号：US10133142B2

公开(公告)日：2018-11-20

申请号：US15472946

申请日：2017-03-29

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Long Chen ,  Ricardo Aroca

IPC: G02F1/035 ,  G02F1/225 ,  G02F1/025 ,  G02F1/21

Abstract: An optical Mach Zehnder modulator is described. The optical Mach Zehnder modulator may comprise a plurality of segments separated by curved waveguides. For example, an optical Mach Zehnder modulator may comprise a first waveguide arm having a first pn-junction formed therein, a second waveguide arm having a second pn-junction formed therein, a third waveguide arm coupled to the first waveguide arm via a first curved waveguide and a fourth waveguide arm coupled to the second waveguide arm via a second curved waveguide. The segments may have the same polarities. Alternatively, the segments may have opposite polarities. The different segments may be driven using different RF signals. The RF signals may be delayed from one another.

公开(公告)号：US09989787B2

公开(公告)日：2018-06-05

申请号：US15455917

申请日：2017-03-10

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr

IPC: G02F1/025 ,  G02F1/015

CPC classification number: G02F1/025 ,  G02F2001/0151

Abstract: Disclosed herein are methods, structures, and devices for a silicon carrier-depletion based modulator with enhanced doping in at least part of slab regions between waveguide core and contact areas. Compared to prior designs, this modulator exhibits lower optical absorption loss and better modulation bandwidth without sacrificing the modulation efficiency when operating at comparable bandwidth settings.

公开(公告)号：US09817249B2

公开(公告)日：2017-11-14

申请号：US13928043

申请日：2013-06-26

Applicant: ACACIA COMMUNICATIONS INC.

Inventor： Christopher Doerr

IPC: G02F1/225 ,  G02F1/01

CPC classification number: G02F1/011 ,  G02F1/2255 ,  G02F1/2257 ,  G02F2201/126 ,  G02F2201/127

Abstract: Disclosed herein is a traveling-wave Mach-Zehnder modulator and method of operating same that advantageously exhibits a reduced optical insertion loss as compared with contemporary Mach-Zehnder structures. Such advantage comes at the modest expense of increased modulator length and increased RF loss.

公开(公告)号：US20170248806A1

公开(公告)日：2017-08-31

申请号：US15455917

申请日：2017-03-10

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr

IPC: G02F1/025

CPC classification number: G02F1/025 ,  G02F2001/0151

Abstract: Disclosed herein are methods, structures, and devices for a silicon carrier-depletion based modulator with enhanced doping in at least part of slab regions between waveguide core and contact areas. Compared to prior designs, this modulator exhibits lower optical absorption loss and better modulation bandwidth without sacrificing the modulation efficiency when operating at comparable bandwidth settings.

公开(公告)号：US20160202432A1

公开(公告)日：2016-07-14

申请号：US14991816

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  G02B6/30 ,  G02B6/28

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。

公开(公告)号：US20160013880A1

公开(公告)日：2016-01-14

申请号：US14860046

申请日：2015-09-21

Applicant: Acacia Communications, Inc.

Inventor： Eric Swanson ,  Christopher Doerr ,  Graeme Pendock

IPC: H04J14/00 ,  H04B10/61

CPC classification number: H04J14/00 ,  H04B10/1121 ,  H04B10/616 ,  H04J14/04

Abstract: Disclosed herein are methods, structures, and devices for optical communications systems operating through turbulent media. More specifically, a spatial division multiplexing photonic integrated circuit is used in conjunction with digital signal processing systems to mitigate the effects of the turbulent media.

Abstract translation: 这里公开了通过湍流介质操作的光通信系统的方法，结构和装置。 更具体地，空间分复用光子集成电路与数字信号处理系统结合使用以减轻紊流介质的影响。