公开(公告)号：US20230215661A1

公开(公告)日：2023-07-06

申请号：US18121305

申请日：2023-03-14

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHUNG-JUI SU

IPC: H01G9/00 ,  H01G9/15 ,  H01G13/02 ,  H01G9/08

CPC classification number: H01G9/0029 ,  H01G9/151 ,  H01G13/02 ,  H01G9/08

Abstract: A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a rough inner surface, and the base layer and the filling layer are limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.

公开(公告)号：US20230215659A1

公开(公告)日：2023-07-06

申请号：US18121266

申请日：2023-03-14

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHUNG-JUI SU

IPC: H01G4/32 ,  H01G4/005 ,  H01G4/224

CPC classification number: H01G4/32 ,  H01G4/005 ,  H01G4/224

Abstract: A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.

公开(公告)号：US20220127414A1

公开(公告)日：2022-04-28

申请号：US17201216

申请日：2021-03-15

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN

IPC: C08G61/12 ,  H01G13/00 ,  H01G9/048 ,  H01G9/025

Abstract: A method for manufacturing an electrolytic capacitor is provided. A conductive polymer solution is applied onto a porous main body. The porous main body includes a porous electrode body having an electrode material and a dielectric layer covering an outer surface of the electrode material. The conductive polymer solution contains conductive polymer particles whose average particle size ranges from 0.5 nm to 50 nm. A solid electrolyte is formed to completely or partially cover a surface of the dielectric layer. A material of the conductive polymer particles includes at least one of polythiophene having at least one sulfonic acid group and polyselenophene having at least one sulfonic acid group. An electrical conductivity of a dry membrane formed from the conductive polymer particles is higher than 25 S/cm. An amount of metal cations in the conductive polymer solution is less than 500 mg/kg.

公开(公告)号：US20210391119A1

公开(公告)日：2021-12-16

申请号：US17022303

申请日：2020-09-16

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHUNG-JUI SU

IPC: H01G4/32 ,  H01G4/224

Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.

公开(公告)号：US20210296054A1

公开(公告)日：2021-09-23

申请号：US17024897

申请日：2020-09-18

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHUNG-JUI SU ,  CHING-FENG LIN ,  MING-TSUNG CHEN

IPC: H01G9/15 ,  H01G9/08

Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

公开(公告)号：US20190019626A1

公开(公告)日：2019-01-17

申请号：US15833018

申请日：2017-12-06

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  MING-TSUNG CHEN

IPC: H01G9/042 ,  C08G61/12 ,  H01G9/012 ,  H01G9/00 ,  H01G9/15 ,  H01G9/10

Abstract: The instant disclosure provides a polymer composite material applied to a solid capacitor, a capacitor package structure using the same and a manufacturing method thereof. The method includes adding an emulsifier, 3,4-ethylenedioxythiophene and poly(styrenesulfonate) into a solvent to form a mixture solution; and initiating the polymerization reaction between the emulsifier, 3,4-ethylenedioxythiophene and poly(styrenesulfonate) for forming the polymer composite material.

公开(公告)号：US20180233293A1

公开(公告)日：2018-08-16

申请号：US15717615

申请日：2017-09-27

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： MING-GOO CHIEN ,  CHIEH LIN

IPC: H01G9/048 ,  H01G9/042 ,  H01G9/012 ,  H01G9/10 ,  H01G9/15

CPC classification number: H01G9/048 ,  H01G9/012 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/10 ,  H01G9/151

Abstract: The present disclosure provides a capacitor package structure and an anti-oxidation electrode foil thereof. The anti-oxidation electrode foil includes a base material structure, a first conductive material structure, and a first carbonaceous material structure. The base material structure has a top surface and a bottom surface. The first conductive material structure is disposed on the top surface of the base material structure. The first carbonaceous material structure is disposed on the first conductive material structure. One portion of the first conductive material structure is a first oxygenated metal compound for contacting the first carbonaceous material structure. The first oxygen-containing metal compound layer is disposed between the other portion of the first conductive material structure and the first carbonaceous material structure so as to prevent oxygen from contacting the other portion of the first conductive material structure.