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公开(公告)号：US20190077975A1
公开(公告)日：2019-03-14
申请号：US15887944
申请日：2018-02-02
发明人： CHIA-YU WU , MING-GOO CHIEN
摘要： A nano composite shielding film and the manufacturing method thereof for high speed signal propagation includes providing a plastic or metal substrate on which a slurry mixed by nano non-metal materials, such as nano carbon, carbon nanotube, graphene and graphite, metals, such as Fe, Ni, Mn and Zn, and polymers is coated, and curing the slurry to form the nano composite shielding film with a three-dimensional structure.
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公开(公告)号：US20180027663A1
公开(公告)日：2018-01-25
申请号：US15360725
申请日：2016-11-23
发明人： MING-GOO CHIEN , KUO-CHEN HUANG , MING-TSUNG LIANG
摘要： A pin-diverging device for releasing stresses and a capacitor detection system are disclosed. The pin-diverging device includes a pin-diverging module and a heat-generating module adjacent to the pin-diverging module. A capacitor includes two conductive pins respectively passing through two through holes of a seat board, and the two conductive pins of the capacitor are slidably mated with the pin-diverging module so as to diverge the two conductive pins of the capacitor. The seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor. The heat-generating module provides a predetermined heat source to the capacitor so as to release stresses in the capacitor.
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公开(公告)号：US20180233293A1
公开(公告)日：2018-08-16
申请号：US15717615
申请日：2017-09-27
发明人： MING-GOO CHIEN , CHIEH LIN
摘要： The present disclosure provides a capacitor package structure and an anti-oxidation electrode foil thereof. The anti-oxidation electrode foil includes a base material structure, a first conductive material structure, and a first carbonaceous material structure. The base material structure has a top surface and a bottom surface. The first conductive material structure is disposed on the top surface of the base material structure. The first carbonaceous material structure is disposed on the first conductive material structure. One portion of the first conductive material structure is a first oxygenated metal compound for contacting the first carbonaceous material structure. The first oxygen-containing metal compound layer is disposed between the other portion of the first conductive material structure and the first carbonaceous material structure so as to prevent oxygen from contacting the other portion of the first conductive material structure.
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公开(公告)号：US20180153041A1
公开(公告)日：2018-05-31
申请号：US15881690
申请日：2018-01-26
发明人： MING-GOO CHIEN , SHIH-SHAN LIU
CPC分类号： H05K1/181 , G02F1/0126 , G02F2202/14 , H01G2/06 , H01G2/10 , H01G2/103 , H01G2/106 , H01G9/08 , H05K2201/10015
摘要： The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a color display layer for showing a color that is changeable by receiving a light source.
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5.发明申请公开(公告)号：US20180122579A1
公开(公告)日：2018-05-03
申请号：US15713820
申请日：2017-09-25
发明人： SHIH-SHAN LIU , MING-GOO CHIEN , HSUAN-YI LIN
摘要： The present disclosure provides a wound capacitor package structure and a wound assembly thereof. The wound capacitor package structure includes a wound assembly, a package assembly, and a conductive assembly. The wound assembly includes a wound positive conductive foil, a wound negative conductive foil, and two wound separator papers. The package assembly is used for enclosing the wound assembly. The conductive assembly includes a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound negative conductive foil. The wound positive conductive foil has a first predetermined width, the wound negative conductive foil has a second predetermined width, each of the two wound separator papers has a third predetermined width, and the first predetermined width of the wound positive conductive foil and the second predetermined width of the wound negative conductive foil are different.
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6.发明申请公开(公告)号：US20180053602A1
公开(公告)日：2018-02-22
申请号：US15372878
申请日：2016-12-08
发明人： MING-GOO CHIEN
摘要： The instant disclosure provides a thin film capacitor for increasing dielectric constant and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the processing unit having a metal-layer forming module and an insulation-layer forming module; forming a plurality of metal layers by the metal-layer forming module, forming a plurality of insulation layers by the insulation-layer forming module, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure. Each insulation layer includes an insulation material layer and a plurality of nanometer materials mixed with the insulation material layer so as to increase the dielectric constant of the multi-layer stacked structure.
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7.发明申请公开(公告)号：US20190115157A1
公开(公告)日：2019-04-18
申请号：US15887756
申请日：2018-02-02
发明人： MING-GOO CHIEN
CPC分类号： H01G4/306 , C23C14/24 , C23C14/568 , H01G4/248 , H01G4/33
摘要： The present invention provides a device for manufacturing a multi-layer stacked structure and a method for manufacturing a thin film capacitor. The method includes providing a carrier substrate, forming a plurality of first material layers and a plurality of second layers that are alternately stacked on top of one another to form a multi-layer stacked structure, and then forming two terminal electrode structures for respectively enclosing two opposite side portions of the multi-layer stacked structure. One of the first material layer and the second material layer has a plurality of conductive particles randomly distributed therein. The conductive particles are heated to form a spherical structure or a sphere-like structure with low melting point and high surface energy at a temperature that is smaller than the degradation temperature of polymers. Therefore, the dielectric constant of the multi-layer stacked structure and the thin film capacitor can be increased.
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公开(公告)号：US20180063959A1
公开(公告)日：2018-03-01
申请号：US15378385
申请日：2016-12-14
发明人： MING-GOO CHIEN , SHIH-SHAN LIU
CPC分类号： H05K1/181 , G02F1/0147 , H01G2/06 , H01G2/10 , H01G2/103 , H01G2/106 , H01G9/08 , H05K3/3426 , H05K2201/10015 , H05K2201/10757
摘要： The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.
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公开(公告)号：US20180063958A1
公开(公告)日：2018-03-01
申请号：US15378174
申请日：2016-12-14
发明人： MING-GOO CHIEN , SHIH-SHAN LIU
CPC分类号： H05K1/181 , G02F1/0126 , G02F2202/14 , H01G2/06 , H01G2/10 , H01G2/103 , H01G2/106 , H01G9/08 , H05K2201/10015
摘要： The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a color display layer for showing a color that is changeable by receiving a light source.
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公开(公告)号：US20170363446A1
公开(公告)日：2017-12-21
申请号：US15331830
申请日：2016-10-22
发明人： KUO-CHEN HUANG , MING-GOO CHIEN , MING-TSUNG LIANG
CPC分类号： H01G9/008
摘要： A capacitor detection system and a passive-type pin-diverging module thereof are disclosed. The passive-type pin-diverging module is applied to two conductive pins of a capacitor, including a base structure and a rotatable structure. The rotatable structure is rotatably disposed on the base structure, and the rotatable structure has a curved surface. The two conductive pins of the capacitor respectively pass through two through holes of a seat board, each conductive pin has a lateral contact surface, the two lateral contact surfaces concurrently slidably contact the curved surface so as to diverge the two conductive pins, and the seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor. The friction resistance between the conductive pin and the rotatable structure is decreased due to the sliding contact between the lateral contact surface and the curved surface.
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