公开(公告)号：US20230273531A1

公开(公告)日：2023-08-31

申请号：US18016225

申请日：2021-06-29

Applicant: ASML Holding N.V.

Inventor： Mohamed SWILLAM ,  Justin Lloyd KREUZER ,  Stephen ROUX

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/706845 ,  G03F7/706849 ,  G03F7/706851 ,  G03F7/70233

Abstract: A metrology system comprises a radiation source, an optical element, first and second detectors, an integrated optical device comprising a multimode waveguide, and a processor. The radiation source generates radiation. The optical element directs radiation toward a target to generate scattered radiation from the target. The first detector receives a first portion of the scattered radiation and generates a first detection signal based on the received first portion. The multimode waveguide interferes a second portion of the scattered radiation using modes of the multimode waveguide. The second detector receives the interfered second portion and generates a second detection signal based on the received interfered second portion. The processor receives the first and second detection signals. The processor analyzes the received first portion, the received interfered second portion, and a propagation property of the multimode waveguide. The processor determines the property of the target based on the analysis.

公开(公告)号：US20200271438A1

公开(公告)日：2020-08-27

申请号：US16650962

申请日：2018-09-14

Applicant: ASML Holding N.V.

Inventor： Parag Vinayak KELKAR ,  Justin Lloyd KREUZER

IPC: G01B11/06 ,  G02B27/28 ,  G02B5/30

Abstract: An inspection apparatus, including: an optical system configured to provide a beam of radiation to a surface to be measured and to receive redirected radiation from the surface; and a detection system configured to measure the redirected radiation, wherein the optical system includes an optical element to process the radiation, the optical element including a Mac Neille-type multilayer polarizing coating configured to produce a reduced chromatic offset of the radiation.

公开(公告)号：US20190204759A1

公开(公告)日：2019-07-04

申请号：US16301521

申请日：2017-05-17

Applicant: ASML Holding N.V.

Inventor： Krishanu SHOME ,  Igor Matheus Petronella AARTS ,  Justin Lloyd KREUZER ,  Irit TZEMAH

IPC: G03F9/00

CPC classification number: G03F9/7049 ,  G03F9/7073 ,  G03F9/7088

Abstract: An alignment system obtains the characteristics of the light coming back from a wafer stack. A beam analyzer measures changes in wavelength, polarization, and beam profile. This measured information allows for in-line process variation corrections. The correction provides optical monitoring of individual mark stack variations, and in turn provides information to reduce individual mark process variation-induced accuracy error.

公开(公告)号：US20230266681A1

公开(公告)日：2023-08-24

申请号：US18012799

申请日：2021-06-09

Applicant: ASML Holding N.V.

Inventor： Mohamed SWILLAM ,  Justin Lloyd KREUZER ,  Stephen ROUX

IPC: G03F9/00

CPC classification number: G03F9/7019 ,  G03F9/7065

Abstract: Systems, apparatuses, and methods are provided for determining the alignment of a substrate. An example method can include emitting a multi-wavelength radiation beam including a first wavelength and a second wavelength toward a region of a surface of a substrate. The example method can further include measuring a first diffracted radiation beam indicative of first order diffraction at the first wavelength in response to an irradiation of the region by the multi-wavelength radiation beam. The example method can further include measuring a second diffracted radiation beam indicative of first order diffraction at the second wavelength in response to the irradiation of the region by the multi-wavelength radiation beam. Subsequently, the example method can include generating, based on the measured first set of photons and the measured second set of photons, an electronic signal for use in determining an alignment position of the substrate.

公开(公告)号：US20230116318A1

公开(公告)日：2023-04-13

申请号：US17798040

申请日：2021-01-21

Applicant: ASML Holding N.V.

Inventor： Krishanu SHOME ,  Justin Lloyd KREUZER

IPC: G03F9/00 ,  G03F7/20

Abstract: An apparatus for and method of sensing multiple alignment marks in which the optical axis of a detector is divided into multiple axes each of which can essentially simultaneously detect a separate alignment mark to generate a signal which can then be multiplexed and presented to a single detector or multiple detectors thus permitting more rapid detection of multiple marks.