公开(公告)号：US11594660B2

公开(公告)日：2023-02-28

申请号：US16809500

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tang-Yuan Chen ,  Meng-Wei Hsieh ,  Cheng-Yuan Kung

IPC: H01L33/14 ,  H01L33/00 ,  H01L33/26

Abstract: A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.

公开(公告)号：US11296043B2

公开(公告)日：2022-04-05

申请号：US16703409

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan Kung ,  Hung-Yi Lin ,  Chang-Yu Lin

IPC: H01L23/367 ,  H01L23/64 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.

公开(公告)号：US11201125B2

公开(公告)日：2021-12-14

申请号：US15442492

申请日：2017-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Chi Hsieh ,  Hung-Yi Lin ,  Cheng-Yuan Kung ,  Pao-Nan Lee ,  Chien-Hua Chen

IPC: H01L23/66 ,  H01L23/498 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H3/02 ,  H01L23/64

Abstract: The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.

公开(公告)号：US11189604B2

公开(公告)日：2021-11-30

申请号：US16653650

申请日：2019-10-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao-Kai Hung ,  Chien-Wei Chang ,  Ya-Chen Shih ,  Hung-Jung Tu ,  Hung-Yi Lin ,  Cheng-Yuan Kung

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/00

Abstract: A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.

公开(公告)号：US11037846B2

公开(公告)日：2021-06-15

申请号：US16578088

申请日：2019-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua Chen ,  Hsu-Chiang Shih ,  Cheng-Yuan Kung ,  Hung-Yi Lin

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/66 ,  H01Q1/22

Abstract: A semiconductor package structure includes a substrate, a die electrically connected to the substrate, and a first encapsulant. The die has a front surface and a back surface opposite to the front surface. The first encapsulant is disposed between the substrate and the front surface of the die. The first encapsulant contacts the front surface of the die and the substrate.

公开(公告)号：US10475734B2

公开(公告)日：2019-11-12

申请号：US16277962

申请日：2019-02-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua Chen ,  Sheng-Chi Hsieh ,  Cheng-Yuan Kung

IPC: H01L21/44 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H05K1/16

Abstract: A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first patterned conductive layer is adjacent to the substrate and opposite to the first surface of the first patterned conductive layer; (3) a first insulation layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first insulation layer is adjacent to the substrate and opposite to the first surface of the first insulation layer; and (4) a second patterned conductive layer extending from the first surface of the first insulation layer to the second surface of the substrate, the second patterned conductive layer electrically connected to the first patterned conductive layer.