摘要:
An apparatus for emitting radiation is provided. The apparatus comprises an antenna formed on a substrate, and a high impedance surface (HIS). The HIS has a plurality of cells formed on the substrate that are arranged to form an array that substantially surrounds at least a portion of the antenna. Each cell generally includes a ground plane, first plate, second plate, and an interconnect. The ground plane is formed on the substrate, while the first plate (which is substantially rectangular) is formed over and coupled to the ground plane. The first plate for each cell is also arranged so as to form a first checkered pattern for the array. The second plate (which is substantially rectangular) is formed over and is substantially parallel to the first plate. The first and second plates are also substantially aligned with a central axis that extends generally perpendicular to the first and second plates hand have a interconnect formed therebetween. The second plate for each cell is also arranged so as to form a second checkered pattern for the array.
摘要:
A loop antenna is provided. The apparatus comprises a substrate, a first metallization layer, and a second metallization layer. The substrate has first and second feed terminals and a ground terminal. The first metallization layer is disposed over the substrate and includes a first window conductive region, a first conductive region, a second conductive region, and a third conductive region. The first conductive region is disposed over and is in electrical contact with the first feed terminal; it is also is substantially circular and located within the first window region. The second conductive region is disposed over and is in electrical contact with the second feed terminal; it is also substantially circular and is located within the first window region. The a third conductive region is disposed over and is in electrical contact with the ground terminal, and the third conductive region substantially surrounds the first window region. The second metallization layer is disposed over and is in electrical contact with the first, second, and third conductive regions of the first metallization layer, and the second metallization layer includes a second window region that is at least partially aligned with the first window region.
摘要:
An apparatus for emitting radiation is provided. The apparatus comprises an antenna formed on a substrate, and a high impedance surface (HIS). The HIS has a plurality of cells formed on the substrate that are arranged to form an array that substantially surrounds at least a portion of the antenna. Each cell generally includes a ground plane, first plate, second plate, and an interconnect. The ground plane is formed on the substrate, while the first plate (which is substantially rectangular) is formed over and coupled to the ground plane. The first plate for each cell is also arranged so as to form a first checkered pattern for the array. The second plate (which is substantially rectangular) is formed over and is substantially parallel to the first plate. The first and second plates are also substantially aligned with a central axis that extends generally perpendicular to the first and second plates hand have a interconnect formed therebetween. The second plate for each cell is also arranged so as to form a second checkered pattern for the array.
摘要:
In higher order sigma-delta modulators (SDMs), there are oftentimes errors introduced by the digital-to-analog (DAC) switches. Namely, parasitic capacitances associated with switches can introduce second harmonic spurs. Here, however, compensation circuits and buffers are provided. The buffers bias the switches in saturation, and the compensation circuits provide a “ground boost” for the buffers. The combination of the buffer and compensation circuit reduces the second harmonic spur, while also improving the Signal-to-Noise Ratio (SNR) and Signal-to-Noise-plus-Distortion Ratio (SNDR).
摘要:
In higher order sigma-delta modulators (SDMs), there are oftentimes errors introduced by the digital-to-analog (DAC) switches. Namely, parasitic capacitances associated with switches can introduce second harmonic spurs. Here, however, compensation circuits and buffers are provided. The buffers bias the switches in saturation, and the compensation circuits provide a “ground boost” for the buffers. The combination of the buffer and compensation circuit reduces the second harmonic spur, while also improving the Signal-to-Noise Ratio (SNR) and Signal-to-Noise-plus-Distortion Ratio (SNDR).