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公开(公告)号：US20190180728A1
公开(公告)日：2019-06-13
申请号：US16271658
申请日：2019-02-08
Applicant: Butterfly Network, Inc.
IPC: G10K11/02 , A61B8/00 , G10K11/165 , G10K11/168 , G10K11/30 , B06B1/02
Abstract: The disclosed embodiments relate to a portable ultrasound device. Specifically, the disclosed embodiments relate to an acoustic lens positioned at an ultrasound probe. The acoustic lens may be configured for impedance matching and signal attenuation. In one embodiment, ultrasound signal attenuation is provided by forming an acoustic lens as a solid admixture of signal attenuating particles in a polymer matrix.
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22.发明申请公开(公告)号：US20190160490A1
公开(公告)日：2019-05-30
申请号：US16245214
申请日：2019-01-10
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Keith G. Fife , Joseph Lutsky , David Grosjean
Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
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公开(公告)号：US10228353B2
公开(公告)日：2019-03-12
申请号：US15648187
申请日：2017-07-12
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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24.发明申请公开(公告)号：US20180243792A1
公开(公告)日：2018-08-30
申请号：US15905289
申请日：2018-02-26
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Susan A. Alie , Joseph Lutsky , David Grosjean
CPC classification number: B06B1/0292 , B81B3/0086 , B81C1/00698 , B81C2201/0173 , B81C2201/115 , B81C2203/038 , G01N29/2406
Abstract: Processes for fabricating capacitive micromachined ultrasonic transducers (CMUTs) are described, as are CMUTs of various doping configurations. An insulating layer separating conductive layers of a CMUT may be formed by forming the layer on a lightly doped epitaxial semiconductor layer. Dopants may be diffused from a semiconductor substrate into the epitaxial semiconductor layer, without diffusing into the insulating layer. CMUTs with different configurations of N-type and P-type doping are also described.
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公开(公告)号：US20170360405A1
公开(公告)日：2017-12-21
申请号：US15631819
申请日：2017-06-23
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife , David Elgena
CPC classification number: A61B8/4477 , A61B8/0883 , A61B8/0891 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4472 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/483 , A61B8/485 , A61B8/488 , A61B8/5207 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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Patent Agency Ranking
公开(公告)号：US20160290970A1
公开(公告)日：2016-10-06
申请号：US15178025
申请日：2016-06-09
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
CPC classification number: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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27.发明申请公开(公告)号：US20160280538A1
公开(公告)日：2016-09-29
申请号：US15177977
申请日：2016-06-09
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
CPC classification number: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
Abstract translation: 与互补金属氧化物半导体（CMOS）基板集成的微加工超声换能器以及制造这种装置的方法进行了描述。 制造可能涉及两个单独的晶片结合步骤。 可以使用晶片结合来制造衬底中的密封空腔。 晶片接合也可以用于将衬底粘合到另一衬底，例如CMOS晶片。 至少第二晶片接合可以在低温下进行。
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28.发明授权公开(公告)号：US09067779B1
公开(公告)日：2015-06-30
申请号：US14635197
申请日：2015-03-02
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
CPC classification number: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
Abstract translation: 与互补金属氧化物半导体（CMOS）基板集成的微加工超声换能器以及制造这种装置的方法进行了描述。 制造可能涉及两个单独的晶片结合步骤。 可以使用晶片结合来制造衬底中的密封空腔。 晶片接合也可用于将衬底粘合到另一衬底，例如CMOS晶片。 至少第二晶片接合可以在低温下进行。
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29.发明授权公开(公告)号：US10525506B2
公开(公告)日：2020-01-07
申请号：US16245214
申请日：2019-01-10
Applicant: Butterfly Network, Inc.
Inventor： Susan A. Alie , Keith G. Fife , Joseph Lutsky , David Grosjean
Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
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公开(公告)号：US10446132B2
公开(公告)日：2019-10-15
申请号：US16271658
申请日：2019-02-08
Applicant: Butterfly Network, Inc.
IPC: G10K11/02 , G10K11/165 , G10K11/168 , G10K11/30 , A61B8/00 , B06B1/02 , A61B8/08
Abstract: The disclosed embodiments relate to a portable ultrasound device. Specifically, the disclosed embodiments relate to an acoustic lens positioned at an ultrasound probe. The acoustic lens may be configured for impedance matching and signal attenuation. In one embodiment, ultrasound signal attenuation is provided by forming an acoustic lens as a solid admixture of signal attenuating particles in a polymer matrix.
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