公开(公告)号：US10679113B2

公开(公告)日：2020-06-09

申请号：US15379569

申请日：2016-12-15

Applicant: CompoSecure LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  B32B9/04 ,  B32B15/04 ,  B32B15/08 ,  B32B27/08 ,  B32B7/12 ,  B32B13/04 ,  B32B13/06 ,  B32B13/12 ,  B32B15/10 ,  B32B15/14 ,  B32B21/08 ,  B32B21/14 ,  B32B27/12 ,  B32B27/36 ,  B32B3/04 ,  B32B3/08 ,  C25D5/02 ,  C25D11/04 ,  C25D11/18 ,  C25D11/24 ,  C25D11/26 ,  C25D11/34 ,  G06K19/02 ,  B32B33/00 ,  B32B21/00 ,  B32B9/00 ,  B32B21/04 ,  B32B3/14 ,  B32B3/30 ,  B32B9/02 ,  B32B15/20 ,  B32B27/38 ,  B32B37/12 ,  B32B37/18 ,  B32B38/06 ,  B32B38/10 ,  B32B38/14 ,  B32B38/00 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D7/00 ,  B32B27/18

Abstract: Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

公开(公告)号：US20190220723A1

公开(公告)日：2019-07-18

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07722 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US10275703B2

公开(公告)日：2019-04-30

申请号：US15887585

申请日：2018-02-02

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06F19/00 ,  G06K19/077 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q7/06 ,  G06K19/02

Abstract: RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.

公开(公告)号：US20180157954A1

公开(公告)日：2018-06-07

申请号：US15887585

申请日：2018-02-02

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  G06K19/02 ,  H01Q7/06 ,  H01Q1/52 ,  H01Q1/22

CPC classification number: G06K19/07773 ,  G06K19/02 ,  G06K19/07771 ,  H01Q1/2225 ,  H01Q1/526 ,  H01Q7/06

Abstract: RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.