STRENGTHENED GLASS SUBSTRATES WITH GLASS FRITS AND METHODS FOR MAKING THE SAME
    23.
    发明申请
    STRENGTHENED GLASS SUBSTRATES WITH GLASS FRITS AND METHODS FOR MAKING THE SAME 审中-公开
    具有玻璃纤维的加强玻璃基材及其制造方法

    公开(公告)号:US20160236966A1

    公开(公告)日:2016-08-18

    申请号:US15134539

    申请日:2016-04-21

    Abstract: Strengthened glass substrates with glass frits and methods for forming the same are disclosed. According to one embodiment, a method for forming a glass frit on a glass substrate may include providing a glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress having a depth of layer DOL and an initial compressive stress CSi. A glass frit composition may be deposited on at least a portion of the surface of the glass substrate. Thereafter, the glass substrate and the glass frit composition are heated in a furnace to sinter the glass frit composition and bond the glass frit composition to the glass substrate, wherein, after heating, the glass substrate has a fired compressive stress CSf which is greater than or equal to 0.70*CSi.

    Abstract translation: 公开了用玻璃料加强的玻璃基板及其形成方法。 根据一个实施例,在玻璃基板上形成玻璃料的方法可以包括提供一种玻璃基板,其包括从玻璃基板的表面延伸到玻璃基板的厚度的压缩应力层,压缩应力的深度为 层DOL和初始压应力CSi。 可以在玻璃基板的表面的至少一部分上沉积玻璃料组合物。 然后,将玻璃基板和玻璃料组合物在炉内加热烧结玻璃料组合物并将玻璃料组合物粘合到玻璃基板上,其中,加热后玻璃基板的烧制压缩应力CSf大于 或等于0.70 * CSi。

    ANTIMONY-FREE GLASS, ANTIMONY-FREE FRIT AND A GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH THE FRIT
    27.
    发明申请
    ANTIMONY-FREE GLASS, ANTIMONY-FREE FRIT AND A GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH THE FRIT 有权
    无反光玻璃,无反光玻璃和玻璃包裹,与玻璃幕墙密封

    公开(公告)号:US20140061623A1

    公开(公告)日:2014-03-06

    申请号:US14014525

    申请日:2013-08-30

    Abstract: An antimony-free glass comprising TeO2 and/or Bi2O3 suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs disposed therein. The antimony-free glass has excellent aqueous durability, good flow, and low glass transition temperature.

    Abstract translation: 描述了适用于玻璃料的TeO 2和/或Bi 2 O 3的无锑玻璃,用于生产气密密封的玻璃包装。 通过提供第一玻璃基板和第二玻璃基板并将无锑玻璃料沉积到第一基板上来制造密封玻璃封装,例如OLED显示装置。 OLED可以沉积在第二玻璃基板上。 然后使用照射源(例如,激光,红外光)来加热玻璃料,其熔化并形成将第一玻璃基板与第二玻璃基板连接的气密密封,并且还保护设置在其中的OLED。 无锑玻璃具有优异的耐水性,良好的流动性和低的玻璃化转变温度。

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