公开(公告)号：US20190155338A1

公开(公告)日：2019-05-23

申请号：US16177429

申请日：2018-11-01

Applicant: Shu-Hung Lin ,  Wang-Hung Yeh ,  Shih-Chin Chou ,  Hsin-Chieh Fang ,  Ping-Chu Tsai ,  Chun-Wen Wang ,  Che-Hsien Lin

Inventor： Shu-Hung Lin ,  Wang-Hung Yeh ,  Shih-Chin Chou ,  Hsin-Chieh Fang ,  Ping-Chu Tsai ,  Chun-Wen Wang ,  Che-Hsien Lin

IPC: G06F1/16

Abstract: A linkage mechanism including a base, at least one first linking rod, a first linkage member and a driving member is provided. Each of the at least one first linking rod includes a first pivot portion and a second pivot portion. Each of the first linking rod is pivoted to the base via the first pivot portion. The first linking member includes a first engaged portion and a first groove along a first direction. Each of the first linking rod is pivoted in the first groove of the first linkage member via the second pivot portion. The first linking rod is connected to the driving member. When the driving member is located at an unlocked position, the first engaged portion is retracted inside the base. When the driving member is moved from the unlocked position to a locked position, the first linking rod is driven by the driving member, so that the first linkage member is moved along a second direction, and the first engaged portion protrudes from the base. An electronic device is further provided.

公开(公告)号：US09653660B1

公开(公告)日：2017-05-16

申请号：US15197797

申请日：2016-06-30

Applicant: Shu-Hung Lin

Inventor： Shu-Hung Lin

IPC: H01L33/52 ,  H01L33/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

CPC classification number: H01L33/52 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3185 ,  H01L33/48 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A chip scale LED packaging method includes the following steps: clamping an upper mold with a plurality of through holes and a plate-shaped lower mold together; allowing bottoms of the plurality of through holes of the upper mold to be sealed by the plate-shaped lower mold to form a pattern of a plurality of grooves; placing chips one by one in corresponding through holes of the plurality of through holes; pouring encapsulation gel into each of the corresponding through holes; separating the upper mold from the plate-shaped lower mold after the encapsulation gel is cured and molded; and separating each cured and molded encapsulation gel from each of the corresponding through holes of the upper mold and taking each cured and molded encapsulation gel out of the upper mold to obtain an individual chip scale LED package.