Abstract:
A molding device includes a male mold and a female mold. The female mold is set opposite to the male mold and forms and a displacement bore and includes insert, which is provided with a heating device, and has a coupling portion. A fixing board is arranged above and coupled to the female mold by at least one guide post, which extends into the displacement bore of the female mold. The fixing board is provided with a cooling metal block, which is extendable into the coupling portion of the female mold to engage the insert to thereby allow the cooling metal block to absorb the heat of the molds for dissipation and thus efficiently lowering the temperature of the molds. The heating device provides thermal energy to set the molds at the optimum temperature for injection molding.
Abstract:
In the manufacture of a semiconductor, a DBARC layer is deposited upon a wafer to prevent reflection. A photo resist layer is deposited upon the DBARC layer and the wafer is selectively exposed to irradiation. The irradiation generates photo acid (H+ ions) in the exposed areas of the photo resist and DBARC. In order to provide better resolution in the DBARC for micro-features, an electric field is generated vertically through the coated wafer before or during post exposure baking (PEB) to create a uniform vertical distribution of H+ ions though the DBARC. The coated wafer is then developed to remove either the unexposed portions, or exposed portion of the DBARC. The cavities formed by the developer have side walls that are substantially vertical as a result of the uniform vertical distribution of the H+ ions.
Abstract:
A method for manufacturing a thin film transistor (TFT) includes the steps of: providing a substrate (1); and forming a TFT circuit on the substrate using laser-induced chemical vapor deposition (LCVD). Detailedly, the method includes providing the bare substrate, cleaning the substrate with cleaning liquid, and successively forming a gate electrode (2), a gate oxide layer (3), a source electrode (5), and a drain electrode (6) on the substrate by LCVD, thus obtaining the thin film transistor. The forming steps may be controlled by one or more computer programs. The LCVD can be pyrolytic LCVD, photolytic LCVD, or photophysical LCVD. The method is simple and inexpensive.
Abstract:
Key to the present invention is the subsequent use of two layers of different positive photoresists, possessing different exposure wavelength sensitivities. It is a general object of the present invention to provide a new and improved method of forming semiconductor integrated circuit devices, and more specifically, in the formation of self-aligned dual damascene interconnects and vias, which incorporates two positive photoresist systems, which have different wavelength sensitivities, to form trench/via openings with only a two-step etching process. In addition, the two layers of photoresist exhibit different etch resistant properties, for subsequent selective reactive ion etching steps. The use of a “high contrast” positive photoresist system has been developed wherein the resist system exposure sensitivity is optimized for wavelengths, deep-UV (248 nm) for the top layer of resist, the trench pattern, and I-line (365 nm) for the bottom layer of resist, the via pattern. The resist system provides a process in dual damascene for trench/via formation and has the following properties: selective etch resistance, thermal stability during processing, ease of processing and developing, and good adhesion properties.
Abstract:
A process for the skeletal isomerization of olefins wherein the olefins are contacted with a SKISO-11 alumina base catalyst to convert into isomerized products effectively under the conversion conditions comprising a temperature of above 200.degree. C. to about 650.degree. C., the pressure of 0.3 to about 10 atmospheres and a molar ratio of hydrogen or nitrogen to olefins feed from 0 to about 10.
Abstract:
The present invention relates to an anti-cracking assembly structure for door and window corner wall and anti-cracking component thereof. The anti-cracking components of the anti-cracking assembly structure for door and window corner wall has a plurality of protruding ribs and grooves formed at intervals on a surface thereof. The protruding ribs and grooves are arc-shaped and arranged in parallel to each other. When the reinforced concrete wall is subjected to an external force and stress is generated at the corner of the door and window frames, the stress can be guided along the arc-shaped protruding ribs and arc-shaped grooves on the surface of anti-cracking component to change the transmission direction of the force at the stress end, so as to transmit and disperse the stress to the peripheral side more quickly. Accordingly, it can more effectively prevent the occurrence of 45-degree shear cracks at the corners.
Abstract:
An antenna module for wireless signal transmission of an electronic device is disclosed. The antenna module comprises an antenna body and a fixing part. The antenna body comprises a radiating element, a grounding element, a connecting element, and a feeding point. The radiating element has a first radiating area and a second radiating area. The connecting element has a first end and a second end. The first end is connected with the first radiating area of the radiating element and the second end is connected with the grounding element. The feeding point is disposed on the radiating element and is used to feed a signal. The fixing part comprises a main body and a first clip portion. The main body is used to match the shape of the antenna body. The first clip portion is used to clip and fix the antenna body.
Abstract:
An optical disc drive suitable for reading a data in an optical disc is provided. The optical disc drive includes a housing, a tray suitable for carrying the optical disc, and a panel. The housing has a first opening, and the panel is disposed at the first opening. The tray is disposed in the housing. The tray has a blocking plate. The blocking plate is disposed on a front edge of the tray, and multiple protrusions are disposed on an upper edge of the blocking plate. Furthermore, the panel has a second opening, and the second opening has multiple notches corresponding to the protrusions. The tray is suitable for exiting out of the housing through the second opening, and the protrusions are suitable for passing through the notches.
Abstract:
A tightening device for positioning a worktable of a machine tool to a base includes a saddle member disposed on the base, and a positioning carrier member carrying the worktable and movable relative to an abutment wall of the saddle member. An elongate adjusting member has a force-delivering end spaced apart from the abutment wall, and a middle threaded segment threadedly engaged with the positioning carrier member such that the force-delivering end is movable towards or away from the abutment wall. A force transmitting member is loosely connected to the positioning carrier member, and is configured such that a spiral force resulting from a screw-in movement is taken up by a proximate end thereof from the force-delivering end, and is transformed to a translation force that moves a distal end thereof to tightly engage the abutment wall.
Abstract:
A method for manufacturing a thin film transistor (TFT) includes the steps of: providing a substrate (1); and forming a TFT circuit on the substrate using laser-induced chemical vapor deposition (LCVD). Detailedly, the method includes providing the bare substrate, cleaning the substrate with cleaning liquid, and successively forming a gate electrode (2), a gate oxide layer (3), a source electrode (5), and a drain electrode (6) on the substrate by LCVD, thus obtaining the thin film transistor. The forming steps may be controlled by one or more computer programs. The LCVD can be pyrolytic LCVD, photolytic LCVD, or photophysical LCVD. The method is simple and inexpensive.