公开(公告)号：US5837427A

公开(公告)日：1998-11-17

申请号：US693655

申请日：1996-08-09

申请人： Se Meyung Hwang ,  Keon Yang Park ,  Young Hwan Shin

发明人： Se Meyung Hwang ,  Keon Yang Park ,  Young Hwan Shin

IPC分类号： H05K3/46 ,  H01L21/48 ,  H05K1/11 ,  H05K3/00 ,  G03C5/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  H05K1/115 ,  H05K3/0023 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K3/4644

摘要： A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip size package) or portable phones. In the build-up multi-layer printed circuit board of the present invention, an inner-layer connecting state is improved. The multi-layer printed circuit board is manufactured by sequentially stacking insulating resin layers and circuit conductor layers based on a build-up method. That is, a first insulating resin layer is necessarily made to undergo an exposure and a development so as to form a first via hole 122. Then a second via hole 124 which is larger than the first via hole 122 is formed on a second insulating resin layer, thereby forming a final V shaped photo via hole 120. Thus build-up multi-layer printed circuit board is manufactured.

摘要翻译： 公开了一种用于制造积层多层印刷电路板的方法，其用于计算机的母板，配有相机的VTR，MCM（多芯片模块），CSP（芯片尺寸封装）或便携式电话。 在本发明的积层多层印刷电路板中，提高了内层连接状态。 多层印刷电路板通过基于积累方法依次堆叠绝缘树脂层和电路导体层来制造。 也就是说，必须使第一绝缘树脂层经受曝光和显影以形成第一通孔122.然后在第二绝缘树脂上形成大于第一通孔122的第二通孔124 从而形成最终的V形光通孔120.由此制造多层印刷电路板。