公开(公告)号：US08097121B2

公开(公告)日：2012-01-17

申请号：US12207139

申请日：2008-09-09

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1189 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，接合到保护带的接合构件的操作量，直到缠绕在接合构件上的分离带基于检测到的信息接触保护带 根据计算出的操作量，接合构件被操作控制到接近保护带，接合构件和分离台在保持接合构件的高度的状态下沿着保护带的表面的方向相对移动 将分离带连接到保护带上，并且分离带与保护带一体地与晶片的表面分离。

公开(公告)号：US08062474B2

公开(公告)日：2011-11-22

申请号：US12234292

申请日：2008-09-19

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1906

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，基于这种检测信息计算针的下降操作距离，以及用于接近保护带的接合构件的下降操作量 直到分离带卷绕在接合构件周围接触保护带。 分离部位形成在保护带中，并且基于计算出的降低操作量来控制每个部件的高度来分离保护带。

公开(公告)号：US07984737B2

公开(公告)日：2011-07-26

申请号：US11898831

申请日：2007-09-17

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B26D5/00

CPC分类号： B26F1/3846 ,  B26D3/085 ,  B26D5/00 ,  B26D5/02 ,  B26D5/32 ,  B26D5/34 ,  B26D7/018 ,  G01B11/06 ,  G01B21/16 ,  H01L21/67132 ,  Y10T83/0567 ,  Y10T83/175 ,  Y10T83/178 ,  Y10T83/2022 ,  Y10T83/2024 ,  Y10T83/4656 ,  Y10T83/4664 ,  Y10T83/515 ,  Y10T83/527 ,  Y10T83/533 ,  Y10T156/12 ,  Y10T156/1343

摘要： In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.

摘要翻译： 在安装有切割刀片的刀架的参考平面与支撑胶带的基部的表面接触的状态下，刀片切割支撑胶带，同时， 刀架靠近基座的表面。 这里，切割刀片的切割刃通过支撑胶带和环形框架之间的接合界面而不穿透支撑胶带的粘合剂层。

公开(公告)号：US20110056615A1

公开(公告)日：2011-03-10

申请号：US12861016

申请日：2010-08-23

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B29C65/50 ,  B32B37/12 ,  B32B37/02 ,  B32B38/00

CPC分类号： B65H35/0013 ,  B29C53/36 ,  B29C63/0056 ,  Y10T156/1015

摘要： A nipper formed of a pair of nip blocks in an open state suction-holds on nip surfaces thereof a front end of the adhesive tape that is folded back with an edge member and separated from a separator. Then, the nip block on a front end side pivots to unite the nip surfaces of the nip blocks to each other. As a result, the adhesive tape is bent inwardly and adhesive layers thereof are adhered to each other to form a tab. The nip block on a rear end side suction-holds a rear end of the cut adhesive tape. Then, the nip block on the rear end side pivots to bend the adhesive tape inwardly for forming a tab.

摘要翻译： 由打开状态的一对夹块形成的夹持器在其压合表面上保持着由边缘构件折回并与分离器分离的胶带的前端。 然后，前端侧的夹持块枢转，将夹持块的夹持面彼此结合。 结果，胶带向内弯曲并且其粘合剂层彼此粘合以形成凸片。 后端侧的夹持块吸住切割的胶带的后端。 然后，后端侧的压区块向内转动以使粘合带向内弯曲以形成突出部。

公开(公告)号：US20110232841A1

公开(公告)日：2011-09-29

申请号：US13050882

申请日：2011-03-17

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B29C65/50 ,  B32B37/10

CPC分类号： H01L21/67132 ,  Y10T156/12

摘要： An elastic body approximately throughout a holding region of a semiconductor wafer is provided in a recess at a center of a holding table that holds the semiconductor wafer. An adhesive tape is joined over a rear face of the semiconductor wafer and a ring frame by rolling a joining roller while the elastic body receives and supports a surface of the semiconductor wafer as a circuit surface.

摘要翻译： 大致在半导体晶片的保持区域的弹性体设置在保持半导体晶片的保持台的中心的凹部中。 粘合带通过滚动接合辊而在半导体晶片的后表面和环形框架上接合，同时弹性体接收并支撑半导体晶片的表面作为电路表面。

公开(公告)号：US20090090451A1

公开(公告)日：2009-04-09

申请号：US12234292

申请日：2008-09-19

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10 ,  B29C65/00

CPC分类号： H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1906

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，基于这种检测信息计算针的下降操作距离，以及用于接近保护带的接合构件的下降操作量 直到分离带卷绕在接合构件周围接触保护带。 分离部位形成在保护带中，并且基于计算出的降低操作量来控制每个部件的高度来分离保护带。

公开(公告)号：US20090065144A1

公开(公告)日：2009-03-12

申请号：US12207139

申请日：2008-09-09

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1105 ,  Y10T156/1189 ,  Y10T156/1972 ,  Y10T156/1983

摘要： A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape.

摘要翻译： 检测接合到安装并保持在分离台上的晶片的保护带的表面高度，接合到保护带的接合构件的操作量，直到缠绕在接合构件上的分离带基于检测到的信息接触保护带 根据计算出的操作量，接合构件被操作控制到接近保护带，接合构件和分离台在保持接合构件的高度的状态下沿着保护带的表面的方向相对移动 将分离带连接到保护带上，并且分离带与保护带一体地与晶片的表面分离。

公开(公告)号：US07387951B2

公开(公告)日：2008-06-17

申请号：US11084133

申请日：2005-03-21

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/78 ,  H01L2221/68327

摘要： The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.

摘要翻译： 本发明涉及一种将半导体晶片沿分型线切割成芯片的半导体晶片切割方法。 形成半导体晶片切成芯片的分型线的半导体晶片由胶带保持。 通过在半导体晶片中的芯片不彼此分离的状态下径向拉伸粘合带，芯片彼此分离，并且芯片之间的间隙延长。

公开(公告)号：US06235144B1

公开(公告)日：2001-05-22

申请号：US09203263

申请日：1998-12-01

申请人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

发明人： Masayuki Yamamoto ,  Makoto Namikawa ,  Eiji Toyoda ,  Shigeji Kuroda ,  Saburo Miyamoto ,  Takao Matsushita

IPC分类号： B32B3500

CPC分类号： H01L21/67132 ,  B08B7/00 ,  B08B7/0028 ,  B08B7/0035 ,  B29C63/0013 ,  G03F7/42 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/1189

摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.

摘要翻译： 一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括： 粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。 当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时， 紫外线。

公开(公告)号：US20120160397A1

公开(公告)日：2012-06-28

申请号：US13312997

申请日：2011-12-07

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B32B38/10

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2221/6839 ,  H01L2221/68395

摘要： A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape.

摘要翻译： 将液体粘合剂施加到半导体晶片的电路表面。 载体与涂覆有粘合剂的半导体晶片的表面接合。 半导体晶片的后表面在保持载体时被研磨。 半导体晶片通过支撑胶带支撑在环形框架上。 载体从半导体晶片去除。 通过将具有大于半导体晶片的直径的宽度的分离带与半导体晶片上的粘合剂接合，将粘合带与半导体晶片与膜状粘合剂一体地分离，然后分离分离带。