公开(公告)号：US09746700B2

公开(公告)日：2017-08-29

申请号：US14326309

申请日：2014-07-08

Applicant: Cisco Technology, Inc.

Inventor： Sean Anderson ,  Mark Webster ,  Kalpendu Shastri

IPC: H04J14/06 ,  H04B10/12 ,  H04B10/00 ,  G02F1/035 ,  G02F1/015 ,  G02F1/01 ,  G02F1/025 ,  G02F1/225

CPC classification number: G02F1/015 ,  G02F1/0123 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/225 ,  G02F2203/50

Abstract: An optical demultiplexer that includes at least one a hybrid phase shifter configured to receive a light signal over a fiber element, the light signal including polarized optical signals. Each phase shifter includes a thermo-optic phase shifter configured to phase shift the light signal, an electro-optic phase shifter configured to phase shift the light signal, and a coupler configured to maintain polarization of the polarized signal components. The optical demultiplexer also includes control circuitry configured to regulate the thermo-optic and electro-optic phase shifters.

公开(公告)号：US09651739B2

公开(公告)日：2017-05-16

申请号：US14946946

申请日：2015-11-20

Applicant: Cisco Technology, Inc.

Inventor： Mark Webster ,  Ravi Sekhar Tummidi

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/122 ,  G02B6/14 ,  G02B6/132 ,  G02B6/10 ,  G02B6/43

CPC classification number: G02B6/30 ,  G02B6/107 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/14 ,  G02B6/305 ,  G02B6/43 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/121 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

公开(公告)号：US20160013868A1

公开(公告)日：2016-01-14

申请号：US14326309

申请日：2014-07-08

Applicant: Cisco Technology, Inc.

Inventor： Sean Anderson ,  Mark Webster ,  Kalpendu Shastri

IPC: H04B10/60 ,  G02F1/015 ,  H04J14/06 ,  G02F1/01

CPC classification number: G02F1/015 ,  G02F1/0123 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/225 ,  G02F2203/50

Abstract: An optical demultiplexer that includes at least one a hybrid phase shifter configured to receive a light signal over a fiber element, the light signal including polarized optical signals. Each phase shifter includes a thermo-optic phase shifter configured to phase shift the light signal, an electro-optic phase shifter configured to phase shift the light signal, and a coupler configured to maintain polarization of the polarized signal components. The optical demultiplexer also includes control circuitry configured to regulate the thermo-optic and electro-optic phase shifters.

Abstract translation: 一种光解复用器，包括至少一个混合移相器，被配置为在光纤元件上接收光信号，所述光信号包括偏振光信号。 每个移相器包括被配置为使光信号相移的热光移相器，被配置为相移光信号的电光移相器和被配置为保持偏振信号分量的偏振的耦合器。 光解复用器还包括被配置为调节热光学和电光移相器的控制电路。

公开(公告)号：US20150010266A1

公开(公告)日：2015-01-08

申请号：US13935277

申请日：2013-07-03

Applicant: Cisco Technology, Inc.

Inventor： Mark Webster ,  Ravi Sekhar Tummidi

IPC: G02B6/122 ,  G02B6/132

CPC classification number: G02B6/30 ,  G02B6/107 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/14 ,  G02B6/305 ,  G02B6/43 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/121 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.

Abstract translation: SOI器件可以包括在外部光源（例如，光纤电缆或激光器）与SOI器件的硅表面层上的硅波导之间耦合光的波导适配器。 在一个实施例中，波导适配器被嵌入到绝缘体层中。 这样做可以使得在将表面层组分添加到SOI器件之前形成波导适配器。 因此，可以使用使用高温的制造技术，而不会损害SOI器件中的其它部件 - 例如，在将热敏部件添加到硅表面层之前形成波导适配器。