Abstract:
A transmitter comprising a plurality of modulator and multiplexer (Mod-MUX) units, each Mod-MUX unit operating at an optical wavelength different from the other Mod-MUX units. The transmitter can additional include in each Mod-MUX unit two optical taps and three photodetectors that are configured to allow the respective Mod-MUX unit to be tuned to achieve thermal stabilization and achieve effective modulation and WDM operation across a range of temperatures. The Mod-MUX transmitter avoids the use of a frequency comb. The Mod-MUX transmitter avoids cross-modulation between different modulators for different laser signals.
Abstract:
A low loss high extinction ratio on-chip polarizer has at bi-layer optical taper with an input port of width W1 that communicates with a mode squeezer, followed by an S-bend (or dump bend), and finally a taper having an output port of width W1. The illumination that passes through the low loss high extinction ratio on-chip polarizer has a TM0 mode converted to a TE1 mode which is lost in the mode squeezer and S-bend section, while an input TE0 mode is delivered at the output as a substantially pure TE0 signal of nearly undiminished intensity.
Abstract:
A transmitter comprising a plurality of modulator and multiplexer (Mod-MUX) units, each Mod-MUX unit operating at an optical wavelength different from the other Mod-MUX units. The transmitter can additional include in each Mod-MUX unit two optical taps and three photodetectors that are configured to allow the respective Mod-MUX unit to be tuned to achieve thermal stabilization and achieve effective modulation and WDM operation across a range of temperatures. The Mod-MUX transmitter avoids the use of a frequency comb. The Mod-MUX transmitter avoids cross-modulation between different modulators for different laser signals.
Abstract:
A lateral Ge/Si APD constructed on a silicon-on-insulator wafer includes a silicon device layer having regions that are doped to provide a lateral electric field and an avalanche region. A region having a modest doping level is in contact with a germanium body. There are no metal contacts made to the germanium body. The electrical contacts to the germanium body are made by way of the doped regions in the silicon device layer.
Abstract translation:构造在绝缘体上硅晶片上的横向Ge / Si APD包括具有掺杂以提供横向电场和雪崩区域的区域的硅器件层。 具有适度掺杂水平的区域与锗体接触。 锗体没有金属接触。 通过硅器件层中的掺杂区域制造锗体的电接触。