公开(公告)号：US20200309470A1

公开(公告)日：2020-10-01

申请号：US16902075

申请日：2020-06-15

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin HUANG ,  Wen-Shiang CHEN ,  Shu-Cheng YANG

IPC: F28D15/04 ,  F28D15/02

Abstract: A vapor chamber having a first plate, a second plate and a brazing structure is provided. The first plate has an outer surface and an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting portions are formed on the inner surface of the first plate. The second plate also has an outer surface and an inner surface spaced apart from the inner surface of the first plate, and the second plate covers the first plate to enclose a chamber. The brazing structure has a sealing portion and a plurality of connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate.

公开(公告)号：US20200064080A1

公开(公告)日：2020-02-27

申请号：US16673212

申请日：2019-11-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin HUANG ,  Ting-Yuan WU ,  Chiu-Kung CHEN ,  Chun-Lung CHIU

IPC: F28D15/04 ,  F28F3/00 ,  F28F13/06

Abstract: A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

公开(公告)号：US20190323781A1

公开(公告)日：2019-10-24

申请号：US16503251

申请日：2019-07-03

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN

IPC: F28D15/04 ,  F28D15/02 ,  F28F13/00

Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. The second pipe disposed in the hollow chamber includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. Two opposite sides of an outer pipe wall of the second pipe directly abut an inner pipe wall of the first pipe. The first pipe further includes a second capillary structure which is disposed in the hollow chamber closer to the evaporator and extended to an outside of the second pipe and occupies at least 2/3 volume of the evaporator. A first part of the first capillary structure and the second capillary structure are connected to each other by winding so as to enhance transportation therebetween.

公开(公告)号：US20190249938A1

公开(公告)日：2019-08-15

申请号：US16264612

申请日：2019-01-31

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin HUANG ,  Sien WU ,  Baoxun HE ,  Ti-Jun WANG

IPC: F28F19/00 ,  F28D15/04 ,  F28D15/02 ,  F28F21/08

CPC classification number: F28F19/00 ,  F28D15/0233 ,  F28D15/04 ,  F28F21/083 ,  F28F21/085 ,  F28F21/086 ,  F28F2225/04 ,  F28F2275/067

Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

公开(公告)号：US20190204015A1

公开(公告)日：2019-07-04

申请号：US16144288

申请日：2018-09-27

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin HUANG ,  Ting-Yuan WU

IPC: F28D15/02 ,  F28D15/04

CPC classification number: F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/046

Abstract: A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

公开(公告)号：US20180202723A1

公开(公告)日：2018-07-19

申请号：US15699726

申请日：2017-09-08

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D2021/0028 ,  H01L23/427

Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

公开(公告)号：US20160153722A1

公开(公告)日：2016-06-02

申请号：US14793132

申请日：2015-07-07

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Sien WU ,  Ti-Jun WANG

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233

Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. Two ends of first pipe along an axial direction of the heat pipe are sealed. The second pipe is disposed in the hollow chamber and includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. The hollow chamber of the first pipe is mainly a channel for vapor, the second pipe is mainly a channel for working fluid, the vapor is driven by the vapor pressure difference to move in the first pipe and from the evaporator to the condenser, and the working fluid is driven by the vapor pressure difference to flow in the second pipe and from the condenser to the evaporator.

Abstract translation: 热管包括第一管和至少第二管。 第一管包括蒸发器，隔热件和冷凝器，它们彼此连通以限定中空室。 沿着热管的轴向的第一管的两端被密封。 第二管设置在中空室中，并且包括容纳空间和布置在容纳空间的靠近蒸发器的一端的第一毛细管结构。 第一管的中空室主要是蒸汽通道，第二管主要是工作流体的通道，蒸气由蒸气压差驱动，在第一管和蒸发器中移动到冷凝器， 工作流体由蒸汽压力差驱动，在第二管和从冷凝器流到蒸发器。