公开(公告)号：US11191192B2

公开(公告)日：2021-11-30

申请号：US16396814

申请日：2019-04-29

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Ryota Tanabe

IPC: H05K7/20 ,  H01L23/473 ,  H01L25/11

Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

公开(公告)号：US10749522B2

公开(公告)日：2020-08-18

申请号：US15784825

申请日：2017-10-16

Applicant: DENSO CORPORATION

Inventor： Ryota Tanabe ,  Kazuya Takeuchi

IPC: B60L3/00 ,  H03K17/66 ,  H02M7/00 ,  H01L25/11 ,  H01L23/64 ,  H01G4/236

Abstract: An electric power conversion apparatus includes at least one semiconductor module, a capacitor, a pair of positive and negative busbars and an insulator. The positive busbar includes a positive busbar base protruding from the capacitor in a Y direction and at least one positive busbar terminal extending perpendicular to an X direction. The negative busbar includes a negative busbar base protruding from the capacitor in the Y direction and at least one negative busbar terminal extending perpendicular to the X direction. The positive and negative busbar bases are arranged to have their major surfaces facing each other in a Z direction. The positive and negative busbar terminals at least partially overlap each other in the X direction with the insulator interposed therebetween. The at least one semiconductor module has a pair of positive and negative power terminals connected respectively to the positive and negative busbar terminals.

公开(公告)号：US10135356B2

公开(公告)日：2018-11-20

申请号：US15655027

申请日：2017-07-20

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Tetsuya Matsuoka ,  Ryota Tanabe

IPC: H05K7/20 ,  H02M7/00

Abstract: A power conversion apparatus includes a capacitor and a heat dissipation member for cooling the capacitor. The capacitor and the heat dissipation member are pressed in an arranging direction in which the capacitor and the heat dissipation member are arranged. The capacitor includes a capacitor element which includes a dielectric body and a metal layer formed on a surface of the dielectric body, an electrode part connected to the metal layer and a bus bar connected to the electrode part. Part of the bus bar is interposed in the arranging direction between the heat dissipation member and the capacitor element.

公开(公告)号：US09773759B2

公开(公告)日：2017-09-26

申请号：US15353009

申请日：2016-11-16

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Hiromi Ichijo ,  Takashi Kawashima

IPC: H01L25/065 ,  B60L11/18 ,  H01L23/053 ,  H01L23/32 ,  H01L23/473 ,  H02M7/00 ,  H05K7/20

CPC classification number: H01L25/0657 ,  B60L11/1874 ,  H01L23/053 ,  H01L23/32 ,  H01L23/473 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H02M7/003 ,  H02M2001/327 ,  H05K7/20927

Abstract: An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

公开(公告)号：US09713293B2

公开(公告)日：2017-07-18

申请号：US14919161

申请日：2015-10-21

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Makoto Okamura ,  Yuuichi Handa ,  Naoki Hirasawa ,  Hiromi Ichijo ,  Ryota Tanabe ,  Tetsuya Matsuoka

IPC: H05K7/20 ,  H01L23/473 ,  H01G4/35 ,  H01G4/40 ,  H01G2/08 ,  H01G4/236 ,  H02M7/00 ,  H01L23/40

CPC classification number: H05K7/20927 ,  H01G2/08 ,  H01G4/236 ,  H01G4/35 ,  H01G4/40 ,  H01L23/473 ,  H01L2023/4025 ,  H02M7/003 ,  Y02T10/7022

Abstract: An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.