公开(公告)号：US12154739B2

公开(公告)日：2024-11-26

申请号：US17964163

申请日：2022-10-12

Applicant: DENSO CORPORATION

Inventor： Tatsuki Nishimata ,  Takashi Kawashima ,  Hajime Oyanagi

IPC: H01H45/12 ,  B60R16/03 ,  H01H45/14 ,  H02J7/14 ,  H05K7/20

Abstract: A power distribution device has a resin part covering a portion of a power line and a portion of a signal line and having a switch adjacent to one surface of the resin part, and a cooling part disposed adjacent to a back surface of the resin part opposite to the one surface. The power line and the signal line each have, inside the resin part, a laid-out portion extending in a planar direction orthogonal to an arrangement direction in which the one surface and the back surface are arranged, and a led-out portion extending from the laid-out portion toward the one surface. The laid-out portion of the power line and the laid-out portion of the signal line are located in a projection area of the cooling unit projected in the arrangement direction, and are separated from each other and arranged in the arrangement direction.

公开(公告)号：US10512199B2

公开(公告)日：2019-12-17

申请号：US15695825

申请日：2017-09-05

Applicant: DENSO CORPORATION ,  TOKIN CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Takashi Kawashima ,  Takashi Yanbe ,  Masahiro Kondou

IPC: H05K7/20 ,  H01L23/473 ,  B60L15/00

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

公开(公告)号：US09812744B2

公开(公告)日：2017-11-07

申请号：US14288684

申请日：2014-05-28

Applicant: DENSO CORPORATION

Inventor： Hiroyoshi Yamamoto ,  Yoshimitsu Inoue ,  Takashi Kawashima

IPC: H01M10/63 ,  H01M2/20 ,  H01M10/48 ,  H01M10/625 ,  H01M10/6553 ,  H01M10/6563 ,  H01M10/655 ,  H01M10/613 ,  H01M10/647

CPC classification number: H01M10/613 ,  H01M2/206 ,  H01M10/482 ,  H01M10/486 ,  H01M10/625 ,  H01M10/63 ,  H01M10/647 ,  H01M10/655 ,  H01M10/6553 ,  H01M10/6563 ,  H01M2220/20

Abstract: The battery pack includes battery cells, bus bars provided for electrical connection among the battery cells, a fluid device that passes a heat transfer medium for exchanging heat with the bus bars or the battery cells, and a control device that obtains data on the bus bars or the battery cells and controls the fluid device based on the obtained data.

公开(公告)号：US09773759B2

公开(公告)日：2017-09-26

申请号：US15353009

申请日：2016-11-16

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Hiromi Ichijo ,  Takashi Kawashima

IPC: H01L25/065 ,  B60L11/18 ,  H01L23/053 ,  H01L23/32 ,  H01L23/473 ,  H02M7/00 ,  H05K7/20

CPC classification number: H01L25/0657 ,  B60L11/1874 ,  H01L23/053 ,  H01L23/32 ,  H01L23/473 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H02M7/003 ,  H02M2001/327 ,  H05K7/20927

Abstract: An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.