摘要:
An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.
摘要:
A damper component for absorbing and dissipating vibration and/or noise resonating from a device is provided. The damper component includes a viscoelastic damper layer, and a continuous constraining layer intimately contacting and encasing the damper layer. The constraining layer has a greater stiffness and higher modulus of dynamic shearing elasticity than the damper layer. The constraining layer is a molded sheet molding compound that is substantially immiscible with the viscoelastomer to provide a discrete interface between the constraining layer and the damper layer.