公开(公告)号：US20060124454A1

公开(公告)日：2006-06-15

申请号：US10540232

申请日：2003-12-23

Applicant: Jorg Wurm ,  Stephane Menard

Inventor： Jorg Wurm ,  Stephane Menard

IPC: B23H3/04

CPC classification number: C25D17/10

Abstract: The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating.

Abstract translation: 本发明涉及一种用于电镀的阳极，其具有阳极基底和屏蔽层，其特征在于当用于电镀时，添加剂降解降低。

公开(公告)号：US20050270129A1

公开(公告)日：2005-12-08

申请号：US11146459

申请日：2005-06-07

Applicant: Stephane Menard ,  Jun Lu

Inventor： Stephane Menard ,  Jun Lu

IPC: H01H50/02 ,  H01H50/04 ,  H01H51/22 ,  H01H61/01 ,  H05K1/00

CPC classification number: H01H61/0107 ,  H01H50/023 ,  H01H50/026 ,  H01H50/043 ,  H01H51/2263 ,  H01H2001/5888 ,  H01H2050/028

Abstract: The electro-mechanical relay comprises a base having a transversal axis and a rocking member operatively connected over the base. The rocking member is pivotable, with reference to the transversal axis, between a first position and a second position. The relay also comprises a first contact provided on the base at a location facing the rocking member and being spaced-apart from the transversal axis, and a second contact having at least a portion provided on the rocking member and being in registry with the first contact. The first and second contacts are configured and disposed to be electrically engaged at the first position of the rocking member, and electrically disengaged from each other at the second position thereof.

Abstract translation: 机电继电器包括具有横向轴线的基座和可操作地连接在基座上的摇摆构件。 摇摆构件相对于横向轴线在第一位置和第二位置之间可枢转。 所述继电器还包括设置在所述基座上的面向所述摇摆构件并且与所述横向轴线间隔开的位置的第一触点，以及具有设置在所述摇摆构件上并与所述第一触点对准的至少一部分的第二触点 。 第一和第二触头被构造和设置为在摇摆构件的第一位置处电接合，并且在其第二位置处彼此电分离。

公开(公告)号：US6071398A

公开(公告)日：2000-06-06

申请号：US944753

申请日：1997-10-06

Applicant: James L. Martin ,  Stephane Menard ,  David N. Michelen

Inventor： James L. Martin ,  Stephane Menard ,  David N. Michelen

IPC: C25D3/38 ,  C25D5/18 ,  H05K3/24 ,  H05K3/42

CPC classification number: C25D3/38 ,  C25D5/18 ,  H05K3/241 ,  H05K3/423 ,  Y10S205/92

Abstract: The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.