Abstract:
An integrated opto-electronic device, a portable reflective projection system and a method for in situ monitoring and adjusting light illumination are provided. The device includes a reflective polarizing composite film (150) configured to receive a source light (210) at a desired non-normal incident angle (221), polarizes and reflects a first portion (211) of said source light (210) as polarized illumination light (16) at a reciprocal angle (222) to said desired non-normal incident angle (221); and a photovoltaic cell (180), adhered to an opposite side of said reflective polarizing composite film (150) to said source light (210), configured to receive a second portion (212) of said source light (210) that passes through said reflective polarizing composite film (150) and transform said second portion (212) to photogenerated charge. Unused illumination can be collected in order to re-store and reuse recovered energy.
Abstract:
A method for processing a thin film micro device on a substrate includes: 1) depositing a carbon film on the substrate as a sacrificial layer; 2) photolithographically defining a first predetermined pattern in the carbon film; 3) etching an unwanted portion of the carbon film outside the first predetermined pattern; 4) depositing a structural film including a single or multiple layers of solid state materials; 5) photolithographically defining a second predetermined pattern in the structural film; 6) etching the discarded portion of the structural film outside the second predetermined pattern; 7) selectively removing the remaining portion of the sacrificial carbon film by using a selective etch process gas in a reactor chamber, so that the overlapped portion of the remaining structural element with the first predetermined pattern is suspended above an underneath cavity above the substrate.
Abstract:
A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency.
Abstract:
An optical projection engine device uses a symmetrical wire grid polarizing beam splitter (PBS) that splits incident illumination to a symmetrical pair of polarized light beams in two orthogonal polarization states, one by reflection and the other by transmission, for illuminating a pair of reflective modulation imagers respectively. In identical geometric configuration, the two synchronized reflective modulation imagers polarization modulate polarized light beams as received, and reflect them back towards the PBS, which through transmission and reflection respectively, combines and projects two modulated light beams through a projection lens system to form a pair of spatially overlapped illumination images of aligned pixels with the same image in two orthogonal polarization states on a projection screen. The device jointly provides improvement optical efficiency and expanded function to three dimensional stereoscopic displays.
Abstract:
A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.
Abstract:
A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.