公开(公告)号：US20110272388A1

公开(公告)日：2011-11-10

申请号：US13186323

申请日：2011-07-19

申请人： Brian W. Baird ,  Kelly J. Bruland ,  Clint R. Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

发明人： Brian W. Baird ,  Kelly J. Bruland ,  Clint R. Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

IPC分类号： B23K26/38

CPC分类号： H01S3/0007 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/0853

摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。

公开(公告)号：US08026158B2

公开(公告)日：2011-09-27

申请号：US11757232

申请日：2007-06-01

申请人： Kelly J. Bruland ,  Mark A. Unrath ,  Douglas E. Holmgren

发明人： Kelly J. Bruland ,  Mark A. Unrath ,  Douglas E. Holmgren

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： B23K26/0622 ,  B23K26/082 ,  B23K2101/40

摘要： Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.

摘要翻译： 系统和方法使用一系列激光脉冲在半导体衬底上或内部处理结构。 在一个实施例中，偏转器被配置为在处理窗口内选择性地偏转激光脉冲。 在半导体衬底上扫描处理窗口，使得多个横向间隔开的行结构同时通过处理窗口。 当扫描处理窗口时，偏转器选择性地偏转处理窗口内的横向间隔的行中的一系列激光脉冲。 因此，可以在单次扫描中处理多行结构。

公开(公告)号：US20110210103A1

公开(公告)日：2011-09-01

申请号：US13104837

申请日：2011-05-10

申请人： Kelly J. Bruland ,  Mark A. Unrath ,  Douglas E. Holmgren

发明人： Kelly J. Bruland ,  Mark A. Unrath ,  Douglas E. Holmgren

IPC分类号： B23K26/00

CPC分类号： B23K26/0622 ,  B23K26/082 ,  B23K2101/40

摘要： Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.

摘要翻译： 系统和方法使用一系列激光脉冲在半导体衬底上或内部处理结构。 在一个实施例中，偏转器被配置为在处理窗口内选择性地偏转激光脉冲。 在半导体衬底上扫描处理窗口，使得多个横向间隔开的行结构同时通过处理窗口。 当扫描处理窗口时，偏转器选择性地偏转处理窗口内的横向间隔的行中的一系列激光脉冲。 因此，可以在单次扫描中处理多行结构。

公开(公告)号：US07982160B2

公开(公告)日：2011-07-19

申请号：US12060199

申请日：2008-03-31

申请人： Brian W. Baird ,  Kelly J. Bruland ,  Clint Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

发明人： Brian W. Baird ,  Kelly J. Bruland ,  Clint Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

IPC分类号： B23K26/36 ,  H01L21/768 ,  H01L21/77

CPC分类号： H01S3/0007 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/0853

摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。

公开(公告)号：US20090242531A1

公开(公告)日：2009-10-01

申请号：US12060199

申请日：2008-03-31

申请人： Brian W. Baird ,  Kelly J. Bruland ,  Clint R. Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

发明人： Brian W. Baird ,  Kelly J. Bruland ,  Clint R. Vandergiessen ,  Mark A. Unrath ,  Brady Nilsen ,  Steve Swaringen

IPC分类号： B23K26/02 ,  B23K26/04 ,  B23K26/08 ,  G06F19/00

CPC分类号： H01S3/0007 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/0853

摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。