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1.发明申请SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOW 有权使用在扫描窗口中分布的激光脉冲处理半导体结构的系统和方法公开(公告)号：US20080299783A1
公开(公告)日：2008-12-04
申请号：US11757232
申请日：2007-06-01
CPC分类号： B23K26/0622 , B23K26/082 , B23K2101/40
摘要： Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.
摘要翻译： 系统和方法使用一系列激光脉冲在半导体衬底上或内部处理结构。 在一个实施例中，偏转器被配置为在处理窗口内选择性地偏转激光脉冲。 在半导体衬底上扫描处理窗口，使得多个横向间隔开的行结构同时通过处理窗口。 当扫描处理窗口时，偏转器选择性地偏转处理窗口内的横向间隔的行中的一系列激光脉冲。 因此，可以在单次扫描中处理多行结构。
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2.发明授权Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window 有权使用横向分布在扫描窗口中的激光脉冲来处理半导体结构的系统和方法公开(公告)号：US08026158B2
公开(公告)日：2011-09-27
申请号：US11757232
申请日：2007-06-01
CPC分类号： B23K26/0622 , B23K26/082 , B23K2101/40
摘要： Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.
摘要翻译： 系统和方法使用一系列激光脉冲在半导体衬底上或内部处理结构。 在一个实施例中，偏转器被配置为在处理窗口内选择性地偏转激光脉冲。 在半导体衬底上扫描处理窗口，使得多个横向间隔开的行结构同时通过处理窗口。 当扫描处理窗口时，偏转器选择性地偏转处理窗口内的横向间隔的行中的一系列激光脉冲。 因此，可以在单次扫描中处理多行结构。
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3.发明申请SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOW 审中-公开使用在扫描窗口中分布的激光脉冲处理半导体结构的系统和方法公开(公告)号：US20110210103A1
公开(公告)日：2011-09-01
申请号：US13104837
申请日：2011-05-10
IPC分类号： B23K26/00
CPC分类号： B23K26/0622 , B23K26/082 , B23K2101/40
摘要： Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan.
摘要翻译： 系统和方法使用一系列激光脉冲在半导体衬底上或内部处理结构。 在一个实施例中，偏转器被配置为在处理窗口内选择性地偏转激光脉冲。 在半导体衬底上扫描处理窗口，使得多个横向间隔开的行结构同时通过处理窗口。 当扫描处理窗口时，偏转器选择性地偏转处理窗口内的横向间隔的行中的一系列激光脉冲。 因此，可以在单次扫描中处理多行结构。
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公开(公告)号：US08358671B2
公开(公告)日：2013-01-22
申请号：US13186323
申请日：2011-07-19
申请人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。
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公开(公告)号：US20110272388A1
公开(公告)日：2011-11-10
申请号：US13186323
申请日：2011-07-19
申请人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
IPC分类号： B23K26/38
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。
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公开(公告)号：US07982160B2
公开(公告)日：2011-07-19
申请号：US12060199
申请日：2008-03-31
申请人： Brian W. Baird , Kelly J. Bruland , Clint Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
IPC分类号： B23K26/36 , H01L21/768 , H01L21/77
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。
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公开(公告)号：US20090242531A1
公开(公告)日：2009-10-01
申请号：US12060199
申请日：2008-03-31
申请人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译： 用激光加工工件包括以第一脉冲重复频率产生激光脉冲。 第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。 该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。 包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。 该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。
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8.发明授权Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features 有权控制激光束定位系统的动态和热负荷，实现工件特征的高通量激光加工公开(公告)号：US08680430B2
公开(公告)日：2014-03-25
申请号：US12330418
申请日：2008-12-08
申请人： Mark A. Unrath
发明人： Mark A. Unrath
CPC分类号： B23K26/40 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/382 , B23K2101/40 , B23K2103/50
摘要： A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features.
摘要翻译： 实现以密集间隔的图案布置的工件特征的高通量激光加工的方法使得在工件特征处理期间激光束定位上的动态和热负载以及引导激光束的光学部件导致的工件特征处理不准确性和质量劣化最小化。 一个优选实施例是用由声光束偏转器（AOD）或电光偏转器（EOD）类型的零惯性光偏转器，电流计头部和线性平台组成的激光束定位系统来实现的， 将激光束定位在工件特征之间。
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9.发明申请LASER DIRECT ABLATION WITH PICOSECOND LASER PULSES AT HIGH PULSE REPETITION FREQUENCIES 有权激光直接与高脉冲重复频率下的PICOSECOND激光脉冲相关公开(公告)号：US20120248075A1
公开(公告)日：2012-10-04
申请号：US13076754
申请日：2011-03-31
申请人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
发明人： Mehmet E. Alpay , Hisashi Matsumoto , Mark A. Unrath , Guangyu Li
CPC分类号： B23K26/0648 , B23K26/0622 , B23K26/0652 , B23K26/082 , B23K26/0861 , B23K26/364 , B23K2101/42 , B23K2103/42 , B23K2103/50
摘要： Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
摘要翻译： 激光直接消融（LDA）产生切割成电介质层的图案，以形成具有受控信号传播特性的导电迹线。 LDA处理包括选择剂量注量以沿着工件表面上的划线去除期望的材料深度，在一系列激光脉冲中选择每个激光脉冲的时间脉冲宽度，以及选择一系列激光脉冲的脉冲重复频率 激光脉冲。 脉冲重复频率至少部分地基于所选择的时间脉冲宽度，以维持沿着划线的所选择的剂量注量。 所选择的脉冲重复频率提供沿着划线的激光点的预定的最小重叠。 LDA工艺还包括根据所选择的剂量注量，时间脉冲宽度和脉冲重复频率产生包括一系列激光脉冲的激光束。
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10.发明申请LASER PROCESSING SYSTEMS USING THROUGH-THE-LENS ALIGNMENT OF A LASER BEAM WITH A TARGET FEATURE 有权使用具有目标特征的激光束的透镜对准的激光加工系统公开(公告)号：US20100301024A1
公开(公告)日：2010-12-02
申请号：US12790093
申请日：2010-05-28
申请人： Mark A. Unrath
发明人： Mark A. Unrath
CPC分类号： B23K26/032 , B23K26/046 , B23K26/0648 , B23K26/0665 , B23K26/08 , B23K26/082 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction. The AOD subsystem may be used for aligning a processing laser beam to workpiece features.
摘要翻译： 用于微加工工件的激光处理系统包括激光源以产生用于处理工件中的特征的激光脉冲，电流计驱动（电流）子系统，以相对于处理轨迹赋予激光束光斑位置的第一相对运动 到工件的表面，以及声光偏转器（AOD）子系统。 AOD子系统可以包括AOD和电光偏转器的组合。 AOD子系统可以根据抖动方向改变作为偏转位置的函数的激光脉冲的强度分布。 AOD子系统可用于将处理的激光束对准工件特征。
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