APPARATUS AND METHOD FOR ACTIVATION OF COMPONENTS OF AN ENERGIZED OPHTHALMIC LENS
    23.
    发明申请
    APPARATUS AND METHOD FOR ACTIVATION OF COMPONENTS OF AN ENERGIZED OPHTHALMIC LENS 有权
    用于激活能量眼镜的组件的装置和方法

    公开(公告)号:US20120075574A1

    公开(公告)日:2012-03-29

    申请号:US13311652

    申请日:2011-12-06

    Abstract: This present invention provides apparatus and methods for the activation of an energized ophthalmic lens. In some embodiments, the present invention provides for activation and deactivation of one or more components via wireless communication with an activation unit external to the ophthalmic lens. In some embodiments, an energized ophthalmic lens contains components which detect external signals, process the detected signal and activate components that change optical characteristics via the control of electrical energy.

    Abstract translation: 本发明提供用于激活眼球透镜的装置和方法。 在一些实施例中,本发明提供通过与眼科镜片外部的激活单元的无线通信来激活和去激活一个或多个组件。 在一些实施例中,通电眼科镜片包含检测外部信号的组件,处理检测到的信号并激活经由电能的控制来改变光学特性的组件。

    Devices and Methods for Ultra Thin Photodiode Arrays on Bonded Supports
    25.
    发明申请
    Devices and Methods for Ultra Thin Photodiode Arrays on Bonded Supports 审中-公开
    超薄型光电二极管阵列在固定支架上的设备和方法

    公开(公告)号:US20100108893A1

    公开(公告)日:2010-05-06

    申请号:US12606012

    申请日:2009-10-26

    CPC classification number: H01L27/1463 H01L27/1464 H01L27/14689

    Abstract: Ultra thin photodiode array structures and fabrication methods are disclosed. The back illuminated or front illuminated photodiode arrays have the active portion fabricated in a semiconductor layer which may be bonded to a supporting substrate layer. The active portion of semiconductor layer may comprise epitaxially grown layer. The isolation regions between pixels of an array may span the epitaxial layer and a semiconductor layer. Electrical contacts to the diodes are made through the bonded substrate or a portion of active layer. Methods of fabrication include steps to form a photodiode array of this type as well as steps to bond this array to supporting substrates. In some embodiments, supporting substrates are temporarily bonded for support of the methods of processing.

    Abstract translation: 公开了超薄光电二极管阵列结构和制造方法。 背照明或前照明光电二极管阵列具有制造在半导体层中的有源部分,该半导体层可以结合到支撑衬底层。 半导体层的有源部分可以包括外延生长层。 阵列的像素之间的隔离区可跨越外延层和半导体层。 通过键合衬底或活性层的一部分制造与二极管的电接触。 制造方法包括形成这种类型的光电二极管阵列的步骤以及将该阵列结合到支撑衬底的步骤。 在一些实施例中,支撑衬底暂时结合以支持加工方法。

    Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
    26.
    发明授权
    Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same 失效
    具有热电和热循环特性的器件及其制造方法

    公开(公告)号:US07514013B2

    公开(公告)日:2009-04-07

    申请号:US11519180

    申请日:2006-09-11

    CPC classification number: H01L35/34 H01L35/32

    Abstract: The present invention relates to methods for forming thermoelectric and thermodiodic devices including a monolayer of multiple conductive material units with a first surface including a composite of multiple conductive units in electrical contact with a conductive substrate; a second surface with a composite of multiple conductive units; an ioni conductor; and a second surface. A resulting device can include a semiconductor device.

    Abstract translation: 本发明涉及用于形成热电和热碘周期器件的方法,其包括多层导电材料单元的单层,第一表面包括与导电基底电接触的多个导电单元的复合物; 具有多个导电单元的复合材料的第二表面; 离子导体; 和第二表面。 所得到的器件可以包括半导体器件。

    Method and apparatus for a cleanspace fabricator
    28.
    发明申请
    Method and apparatus for a cleanspace fabricator 审中-公开
    清洁空间制造者的方法和装置

    公开(公告)号:US20080146142A1

    公开(公告)日:2008-06-19

    申请号:US11980850

    申请日:2007-10-31

    Abstract: A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a nonsegmented cleanspace or have its tools vertically stacked.

    Abstract translation: 制造厂可以被构造为圆形或矩形的环形管,其主要清洁空间位于其内管和外管之间。 工厂可以被包围,工具可以密集包装,同时保持单向空气流动。 如果只有工具端口在内部,并且使用机器人,则可以将主要清洁空间大小最小化。 可以使用高度简化的机器人。 工具可以集中删除和修复。 可以为工具主体添加辅助清理空间。 多层结构增强了预制单元的使用,用于生产厂房或维护。 应用于传统平面洁净室的曲线或折叠可以构造出广泛的晶圆几何形状,包括管状非环形晶圆厂。 还可以根据环形管的弯曲或非弯曲截面切割来制造晶圆厂。 非弯曲部分的新颖工厂可以包括非分段清洁空间或将其工具垂直堆叠起来。

    Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them

    公开(公告)号:US12189828B2

    公开(公告)日:2025-01-07

    申请号:US17942773

    申请日:2022-09-12

    Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.

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