Abstract:
This invention discloses methods and apparatus for providing a media insert with an energy source to an ophthalmic lens. The energy source is capable of powering a component included within the ophthalmic lens. In some embodiments, an ophthalmic lens is cast molded from a silicone hydrogel and the component includes an electro-optical lens portion.
Abstract:
This invention discloses methods and apparatus for providing an ophthalmic lens with a stacked integrated component device for function. In some embodiments, the stacked integrated component device may contain an energy source capable of powering an electrical component incorporated into the lens.
Abstract:
This present invention provides apparatus and methods for the activation of an energized ophthalmic lens. In some embodiments, the present invention provides for activation and deactivation of one or more components via wireless communication with an activation unit external to the ophthalmic lens. In some embodiments, an energized ophthalmic lens contains components which detect external signals, process the detected signal and activate components that change optical characteristics via the control of electrical energy.
Abstract:
This invention discloses methods and apparatus for providing a media insert with a Data Processor into an ophthalmic lens. An energy source is capable of powering the Data Processor included within the ophthalmic lens. In some embodiments, an ophthalmic lens is cast molded from a silicone hydrogel.
Abstract:
Ultra thin photodiode array structures and fabrication methods are disclosed. The back illuminated or front illuminated photodiode arrays have the active portion fabricated in a semiconductor layer which may be bonded to a supporting substrate layer. The active portion of semiconductor layer may comprise epitaxially grown layer. The isolation regions between pixels of an array may span the epitaxial layer and a semiconductor layer. Electrical contacts to the diodes are made through the bonded substrate or a portion of active layer. Methods of fabrication include steps to form a photodiode array of this type as well as steps to bond this array to supporting substrates. In some embodiments, supporting substrates are temporarily bonded for support of the methods of processing.
Abstract:
The present invention relates to methods for forming thermoelectric and thermodiodic devices including a monolayer of multiple conductive material units with a first surface including a composite of multiple conductive units in electrical contact with a conductive substrate; a second surface with a composite of multiple conductive units; an ioni conductor; and a second surface. A resulting device can include a semiconductor device.
Abstract:
A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a nonsegmented cleanspace or have its tools vertically stacked.
Abstract:
The present disclosure provides various advancements for mobile and automated processing utilizing additive manufacturing. The present disclosure includes methods for the utilization of mobile and automated processing apparatus and may include examples of printing three dimensional items. In some examples, printing concrete structures may be performed. Artificial intelligence techniques may enhance operations and may be used to create model for the processing apparatus.
Abstract:
The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.