公开(公告)号：US20170212253A1

公开(公告)日：2017-07-27

申请号：US15004127

申请日：2016-01-22

Applicant: General Electric Company

Inventor： Geng Fu ,  Peter Michael Edic ,  Brian David Yanoff ,  Jianjun Guo ,  Xin Wang ,  Bruno Kristiaan Bernard De Man ,  Xue Rui ,  Yannan Jin

IPC: G01T1/24 ,  G01T1/20 ,  A61B6/03 ,  H01L27/146

CPC classification number: G01T1/247 ,  A61B6/032 ,  A61B6/4233 ,  A61B6/4241 ,  A61B6/4291 ,  G01T1/17 ,  G01T1/2018 ,  H01L27/14658

Abstract: A detector panel is described having readout circuitry integrated with the photodetectors, such as in the light imager panel. The detector is useful in high spatial resolution and low-dose or low-signal imaging contexts and may be used in adaptive 2D binning configurations. Adaptive binning of detector elements may be accomplished using control logic and X-ray intensity detector circuitry capable of assessing an incident X-ray intensity and controlling binning of an associated group of detector elements.

公开(公告)号：US20170086761A1

公开(公告)日：2017-03-30

申请号：US14868826

申请日：2015-09-29

Applicant: General Electric Company

Inventor： Geng Fu ,  Peter Michael Edic ,  Brian David Yanoff ,  Jianjun Guo ,  Vladimir A. Lobastov ,  Yannan Jin

IPC: A61B6/00 ,  A61B6/03

CPC classification number: A61B6/4241 ,  A61B6/032 ,  A61B6/4208 ,  A61B6/4233 ,  A61B6/4435 ,  A61B6/4441 ,  A61B6/461 ,  A61B6/467 ,  A61B6/5205 ,  A61B6/54

Abstract: Some embodiments are associated with an input signal comprising a first and a second photon event incident on a photon-counting semiconductor detector. A relatively slow charge collection shaping amplifier may receive the input signal and output an indication of a total amount of energy associated with the superposition of the first and second events. A relatively fast charge collection shaping amplifier may receive the input signal and output an indication that is used to allocate a first portion of the total amount of energy to the first event and a second portion of the total amount of energy to the second event.

公开(公告)号：US09571765B2

公开(公告)日：2017-02-14

申请号：US14750067

申请日：2015-06-25

Applicant: General Electric Company

Inventor： Jianjun Guo ,  Brian David Yanoff ,  Jonathan David Short ,  Biju Jacob

IPC: H04N5/335 ,  H04N5/369 ,  H04N5/378

CPC classification number: H04N5/369 ,  H01L27/14641 ,  H04N5/347 ,  H04N5/37457 ,  H04N5/378

Abstract: An imager including sub-imager pixel arrays having a plurality of four-side buttable imagers distributed on a substrate and an on-chip digitizing readout circuit. Pixel groupings formed from among the plurality of four-side buttable imagers. The readout electronics including a buffer amplifier for each of the pixel groupings and connected to respective outputs of each four-side buttable imager of the pixel grouping. A plurality of shared analog front ends, each shared analog front end connected to respective multiple buffer amplifiers from among the plurality of pixel groupings. An analog-to-digital converter located at a common centroid location relative to the plurality of shared analog front ends, the analog-to-digital converter having a fully addressable input selection to individually select an output from each of the plurality of shared analog front ends. An output of the analog-to-digital converter connected to a trace on a back surface of the wafer substrate by a through-substrate-via.

Abstract translation: 包括具有分布在基板上的多个四边对称成像器的子成像像素阵列和片上数字化读出电路的成像器。 从多个四面对面的成像器中形成的像素组。 读出电路包括用于每个像素分组的缓冲放大器，并且连接到像素分组的每个四面可图像成像器的相应输出。 多个共享模拟前端，每个共享模拟前端从多个像素分组中连接到相应的多个缓冲放大器。 一种模数转换器，位于相对于多个共享模拟前端的公共中心位置处，该模数转换器具有完全可寻址的输入选择，以单独选择多个共享模拟前端中的每一个的输出 结束。 模数转换器的输出通过基板通孔连接到晶片衬底背面上的迹线。

公开(公告)号：US20170031038A1

公开(公告)日：2017-02-02

申请号：US14815107

申请日：2015-07-31

Applicant: General Electric Company

Inventor： James Wilson Rose ,  David Leo McDaniel ,  Jianjun Guo ,  Sergei Ivanovich Dolinsky ,  Adrian Ivan

IPC: G01T1/20 ,  H01L27/146 ,  G01T1/29

CPC classification number: G01T1/2018 ,  G01T1/208 ,  G01T1/2985 ,  H01L27/14663 ,  H01L27/14685

Abstract: A photon detector having an optical transparent plate and photodiode array interconnected by an optical light guide array. The optical light guide array including elements providing a transmission line between the optical transparent plate and the photodiode array, where the position of one or more optical light guide elements is formed to adjust for a miss-registered photodiode individual element. A method for assembling the photon detector includes depositing a non-wetting film on opposing surfaces of the optical transparent plate and/or photodiode array, altering the deposited non-wetting film in regions of individual photodiode elements, dispensing an optical coupler adhesive on the optical transparent plate and photodiode array to form adhesive beads, aligning the opposing surfaces, assembling the opposing surfaces so that the corresponding optical coupler adhesive beads contact each other, and curing the optical coupler adhesive to form a structurally merged photon detector having optical light guide elements.

Abstract translation: 一种光子检测器，具有通过光学导光阵列互连的光学透明板和光电二极管阵列。 所述光导引阵列包括在所述光学透明板和所述光电二极管阵列之间提供传输线的元件，其中形成一个或多个光导元件的位置以调整未注册的光电二极管单独元件。 用于组装光子检测器的方法包括在光学透明板和/或光电二极管阵列的相对表面上沉积非润湿膜，改变在各个光电二极管元件的区域中沉积的非润湿膜，在光学器件上分配光学耦合器粘合剂 透明板和光电二极管阵列以形成粘合剂珠，对准相对表面，组装相对表面，使得相应的光耦合器粘合剂珠彼此接触，并固化光耦合器粘合剂以形成具有光学导光元件的结构上合并的光子检测器。

公开(公告)号：US20150108328A1

公开(公告)日：2015-04-23

申请号：US14061557

申请日：2013-10-23

Applicant: General Electric Company

Inventor： Jianjun Guo ,  Chang Lyong Kim ,  David Leo McDaniel ,  James Lindgren Malaney ,  Sergei Ivanovich Dolinsky

IPC: H04N5/361 ,  G01J1/18

CPC classification number: H04N5/361 ,  G01J1/18 ,  G01J2001/186 ,  G01J2001/444 ,  G01T1/249 ,  H01L31/02164 ,  H04N5/2176

Abstract: A compensating current is applied at one or more points in a signal processing path to compensate for one or both of a dark or offset current present in an input signal. In certain implementations, the dark or offset current is present in a signal generated by a photomultiplier device. The dark or offset current may be monitored in an output of the signal processing path and, the monitoring being used to determine how much compensation is needed in the signal processing path and to allocate where in the signal processing path the compensation current will be applied.

Abstract translation: 在信号处理路径中的一个或多个点处施加补偿电流以补偿输入信号中存在的暗或偏移电流中的一个或两个。 在某些实施方案中，暗或偏移电流存在于由光电倍增器装置产生的信号中。 可以在信号处理路径的输出中监视暗或偏移电流，并且监视用于确定在信号处理路径中需要多少补偿并且在信号处理路径中分配补偿电流将被施加的位置。

公开(公告)号：US10571579B2

公开(公告)日：2020-02-25

申请号：US15004214

申请日：2016-01-22

Applicant: General Electric Company

Inventor： Yannan Jin ,  Geng Fu ,  Peter Michael Edic ,  Brian David Yanoff ,  Jianjun Guo

IPC: G01T1/20 ,  G01T1/24 ,  G01T1/17

Abstract: A detector is described having readout electronics integrated in the photodetector layer. The detector may be configured to acquire both energy-integrated and photon-counting data. In one implementation, the detector is also configured with control logic to select between the jointly generated photon-counting and energy-integrated data.

公开(公告)号：US10371835B2

公开(公告)日：2019-08-06

申请号：US14992635

申请日：2016-01-11

Applicant: General Electric Company

Inventor： Jianjun Guo ,  Adrian Ivan ,  Sergei Ivanovich Dolinsky ,  Geng Fu

IPC: G01T1/24 ,  H01L27/146 ,  G01T1/208

Abstract: A silicon photomultiplier array including a plurality of microcells arranged in rows and columns. A plurality of circuit traces connecting microcell output ports to the array pixel output port, with one or more impedance matching networks connected to at least one of the circuit traces. The impedance matching networks can be connected between each row circuit trace and the pixel output port. Impedance matching networks can be located between junctions of adjacent microcell output ports and row circuit traces.

公开(公告)号：US09851455B2

公开(公告)日：2017-12-26

申请号：US14688008

申请日：2015-04-16

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Sergei Ivanovich Dolinsky ,  Jianjun Guo ,  David Leo McDaniel ,  Ravindra Mohan Manjeshwar ,  Geng Fu

IPC: G01T1/24

CPC classification number: G01T1/247

Abstract: Embodiments of a solid state photomultiplier are provided herein. In some embodiments, a solid state photomultiplier may include a plurality of pixels, wherein each pixel of the plurality of pixels comprises a plurality of subpixels; and a first set of buffer amplifiers, wherein each buffer amplifier of the first set of buffer amplifiers is respectively coupled to a subpixel of the plurality of subpixels.

公开(公告)号：US09754981B2

公开(公告)日：2017-09-05

申请号：US15077006

申请日：2016-03-22

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Jianjun Guo ,  Sergei Ivanovich Dolinsky ,  Jonathan David Short

IPC: H01L27/146 ,  H01L31/107 ,  H01L31/0352

CPC classification number: H01L27/14612 ,  H01L27/14663 ,  H01L31/035272

Abstract: Embodiments of a solid state photomultiplier are provided herein. In some embodiments, a solid state photomultiplier may include an epitaxial layer, a high voltage region formed in the epitaxial layer, a low voltage region formed in the epitaxial layer, and an intermediate region disposed between the high voltage region and low voltage region, wherein the high voltage region is electrically coupled to the low voltage region via the intermediate region, and wherein at least a portion of the epitaxial layer is disposed between the high voltage region and intermediate region and between the low voltage region and the intermediate region.

公开(公告)号：US09541448B2

公开(公告)日：2017-01-10

申请号：US14615806

申请日：2015-02-06

Applicant: General Electric Company

Inventor： Jianjun Guo ,  Sergei Ivanovich Dolinsky

IPC: G01J1/42 ,  G01J1/44

CPC classification number: G01J1/4228 ,  G01J1/44 ,  G01J2001/4466 ,  G01T1/248 ,  G01T1/2985

Abstract: A silicon photomultiplier array of microcells including a photon avalanche diode and an electronic circuit configured to provide a first one-shot pulse and a second one-shot pulse based on a detected current flowing through the photon avalanche diode. The microcells arranged in rows and columns with each microcell of a respective row connected to a respective row data bus connected to a row counter configured to count one or more first one-shot pulses for a predetermined time period, a pixel adder configured to sum the count, and a digital-to-analog converter connected to the pixel adder to convert sum to an analog signal representative of an energy readout. A timing logic circuit configured to provide a validation signal to a counter control logic circuit, and the counter control logic circuit configured to provide one of a start signal, a stop signal, and a reset signal to the row counter.

Abstract translation: 包括光子雪崩二极管和电子电路的微电池的硅光电倍增管阵列，被配置为基于流过光子雪崩二极管的检测电流提供第一单触发脉冲和第二单触发脉冲。 微电池以行和列排列，每行的每个微电池连接到连接到配置成在一个预定时间段内对一个或多个第一单触发脉冲进行计数的行计数器的相应行数据总线;像素加法器， 计数器和连接到像素加法器的数模转换器将和转换为表示能量读出的模拟信号。 定时逻辑电路，被配置为向计数器控制逻辑电路提供有效信号，并且所述计数器控制逻辑电路经配置以向所述行计数器提供起始信号，停止信号和复位信号中的一个。