公开(公告)号：US20230191696A1

公开(公告)日：2023-06-22

申请号：US18108609

申请日：2023-02-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Kristopher J. Erickson ,  Howard S. Tom ,  Lihua Zhao

IPC: B29C64/165 ,  B33Y10/00 ,  B29C64/291 ,  B29C64/336 ,  C04B35/636 ,  C04B35/634 ,  B33Y40/20 ,  B33Y70/10 ,  B22F10/16 ,  B33Y50/02 ,  B28B1/00

CPC classification number: B29C64/165 ,  B33Y10/00 ,  B29C64/291 ,  B29C64/336 ,  C04B35/636 ,  C04B35/634 ,  C04B35/63432 ,  C04B35/63468 ,  C04B35/63408 ,  C04B35/63444 ,  C04B35/63488 ,  B33Y40/20 ,  B33Y70/10 ,  B22F10/16 ,  B33Y50/02 ,  B28B1/001 ,  C04B2235/6026

Abstract: According to an example, a composition may include a high melt temperature build material in the form of a powder; a first low melt temperature binder in the form of a powder; and a second low melt temperature binder in the form of a powder; and in which the first low melt temperature binder melts at a temperature that is different from the second low melt temperature binder.

公开(公告)号：US20220331867A1

公开(公告)日：2022-10-20

申请号：US17857362

申请日：2022-07-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony

IPC: B22F10/14 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/165 ,  B28B1/00 ,  C04B35/622 ,  C04B35/634 ,  C04B35/64 ,  B22F1/054

Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.

公开(公告)号：US20220234289A1

公开(公告)日：2022-07-28

申请号：US17417130

申请日：2019-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： William J. Allen ,  Melanie Martin Citta ,  John C. Greeven ,  Kristopher J. Erickson ,  Jarrid Wittkopf ,  Temiloluwa Adegoke

IPC: B29C64/188 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29C64/165

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form 1) a three-dimensional (3D) printed object and a container structure to form part of the 3D printed object. The container structure expels a payload when a predetermined condition is met. The additive manufacturing system also includes a payload distributor to place the payload in the container structure. A controller of the additive manufacturing system controls formation of the 3D printed object and the container structure.

公开(公告)号：US11338510B2

公开(公告)日：2022-05-24

申请号：US16606285

申请日：2018-06-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Krzysztof Nauka ,  Thomas Anthony ,  Kristopher J. Erickson

IPC: B29C64/218 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B29C64/321 ,  B29C64/295 ,  B29C64/393 ,  B29C64/241

Abstract: A three-dimensional (3D) printing device includes a first cylinder. The first cylinder may include a first plurality of holes defined therein. The 3D printing device may include a second cylinder interior and coaxial to the first cylinder that includes a second plurality of holes open to an interior of the first cylinder. The 3D printing device may also include a third cylinder interior to the first cylinder and exterior to the second cylinder, the third cylinder including a longitudinal cutout open to the first cylinder. The 3D printing device may include a supply tube open to the second cylinder, the supply tube to provide an amount of build material to an interior portion of the second cylinder.

公开(公告)号：US11338363B2

公开(公告)日：2022-05-24

申请号：US16077330

申请日：2017-06-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson

IPC: B22F1/10 ,  B22F10/10 ,  B22F12/20 ,  B22F12/90 ,  B22F1/054 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/10

Abstract: At a print temperature, a layer (having a predetermined height) of metal build material particles is formed. Also at the print temperature, a fluid containing metal nanoparticles is selectively applied to at least a portion of the layer, and at a fluid loading that wets the portion through the predetermined height without saturating the portion. The metal nanoparticles are exposed to a sintering temperature that is higher than the print temperature and at least 500° below a melting point of the metal build material particles using a predetermined number of heating events taking place at a predetermined speed or for a predetermined time, and separated by a predetermined delay time, to bind the metal build material particles together to form a bound layer. A build material surface is cooled to or below the print temperature. The forming, selectively applying, exposing, and cooling are repeated to form a part precursor.

公开(公告)号：US20220019193A1

公开(公告)日：2022-01-20

申请号：US17299765

申请日：2019-04-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： M. Anthony Lewis ,  William J. Allen ,  Kristopher J. Erickson ,  Jarrid Wittkopf ,  Robert lonescu ,  Douglas Pederson

IPC: G05B19/4099 ,  B29C64/379 ,  B29C64/393 ,  B33Y40/20 ,  B33Y50/02 ,  B29C64/165 ,  B33Y30/00

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a movement device to move a mass with an object disposed therein. A receiver of the system receives accelerometer data from at least one accelerometer disposed within the mass in which the object is disposed. A controller of the system determines a pose of the object within the mass based on received accelerometer data.

公开(公告)号：US20210362411A1

公开(公告)日：2021-11-25

申请号：US16606310

申请日：2018-03-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  David George ,  Sterling Chaffins ,  Lihua Zhao

IPC: B29C64/194 ,  B29C64/165 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46 ,  H05K1/18

Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

公开(公告)号：US20190030788A1

公开(公告)日：2019-01-31

申请号：US16072123

申请日：2016-05-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Lihua Zhao ,  Howard S. Tom ,  Aja Hartman ,  Yan Zhao ,  Andrew E. Fitzhugh

IPC: B29C64/112 ,  B29C64/264 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y70/00

Abstract: In an example of a three-dimensional (3D) printing method, a polymeric build material is applied. A fusing agent is selectively applied on at least a portion of the polymeric build material. A mechanical tailoring agent is selectively applied on at least a region of the portion. The polymeric build material is exposed to radiation, thereby fusing the at least the portion of the polymeric build material in contact with the fusing agent to form a layer. The mechanical tailoring agent forms a composite layer in the at least the region, and the composite layer has a different mechanical property than that of an area of the layer not in contact with the mechanical tailoring agent.

公开(公告)号：US20180272601A1

公开(公告)日：2018-09-27

申请号：US15763200

申请日：2015-10-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Thomas Anthony ,  Howard S. Tom ,  Sivapackia Ganapathiappan ,  Lihua Zhao ,  Krzysztof Nauka

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/20 ,  B29C64/393 ,  B33Y50/02

CPC classification number: B29C64/165 ,  B22F3/008 ,  B22F2999/00 ,  B29C64/20 ,  B29C64/393 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  C09B47/065 ,  C09B47/0678 ,  C09B47/24 ,  B22F1/007 ,  B22F1/0074 ,  B22F1/0018

Abstract: In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.

公开(公告)号：US11845129B2

公开(公告)日：2023-12-19

申请号：US16076162

申请日：2017-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony

IPC: B22F10/28 ,  B33Y10/00 ,  B33Y80/00 ,  B22F1/054 ,  B33Y70/10 ,  B22F10/14 ,  B22F1/103

CPC classification number: B22F10/28 ,  B22F1/054 ,  B22F10/14 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y80/00 ,  B22F1/103 ,  B22F2302/105 ,  B22F2302/20 ,  B22F2302/253 ,  B22F2302/40 ,  B22F2999/00 ,  B22F1/054 ,  B22F10/10 ,  B22F1/052 ,  B22F2999/00 ,  B22F10/14 ,  B22F1/052 ,  B22F1/054

Abstract: According to examples, a brown body has from about 0.02 wt. % to about 10 wt. % of a metal nanoparticle binder, in which the metal nanoparticle binder is selectively located within an area of the brown body to impart a strength greater than about 1 kPa to the area.