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    OVERMOLDED INK DELIVERY DEVICE
    21.
    发明申请
    OVERMOLDED INK DELIVERY DEVICE 有权
    超重墨水输送装置

    公开(公告)号：US20170036451A1

    公开(公告)日：2017-02-09

    申请号：US15304767

    申请日：2014-04-24

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua CHEN ,  Michael W Cumbie ,  Devin Alexander Mourey

    IPC: B41J2/175

    CPC classification number: B41J2/17553 ,  B41J2/14145 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/17513 ,  B41J2/17559 ,  B41J2002/14362

    Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.

    Abstract translation: 描述了墨水输送装置。 油墨输送装置包括具有第一表面的油墨模头。 墨水输送装置还包括用于封装墨水模具的多个表面的包覆成型。 包覆模具具有比第一表面更宽的第二表面。 第二表面接收粘合剂以将墨水输送装置附着到打印头。 墨水输送装置还包括通过包覆成型体和至少一部分墨水模头的墨水槽。

    CAPILLARY STRUCTURES
    22.
    发明申请
    CAPILLARY STRUCTURES 有权

    公开(公告)号：US20230025338A1

    公开(公告)日：2023-01-26

    申请号：US17783049

    申请日：2019-12-18

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Robert S Wickwire ,  David N Olsen ,  Michael W Cumbie

    IPC: B41J2/175

    Abstract: An example fluidic device comprises a fluid reservoir having a porous media arranged within the reservoir, and a capillary structure. The capillary structure is in fluid communication with the porous media and the fluid reservoir and has tuned parameters corresponding to parameters of the fluid reservoir and the porous media. Wherein fluid within the capillary structure is to change level in response to pressure changes in the reservoir.

    CAPILLARY STRUCTURES
    23.
    发明申请
    CAPILLARY STRUCTURES 有权

    公开(公告)号：US20230001697A1

    公开(公告)日：2023-01-05

    申请号：US17781565

    申请日：2019-12-18

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Robert S Wickwire ,  David N Olsen ,  Michael W Cumbie

    IPC: B41J2/175

    Abstract: An example fluidic device comprises a fluid reservoir and a capillary structure. The fluid reservoir has a porous media arranged within and the capillary structure is in fluid communication with the porous media reservoir and the fluid reservoir. The capillary structure has tuned parameters corresponding to parameters of the porous media. An internal fluid path of the capillary structure enables three or more fill readings based on a height of a fluid within the capillary structure and further based on the tuned parameters of the capillary structure.

    Conductive elements electrically coupled to fluidic dies
    25.
    发明授权
    Conductive elements electrically coupled to fluidic dies 有权

    公开(公告)号：US11186082B2

    公开(公告)日：2021-11-30

    申请号：US16958585

    申请日：2019-04-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie

    IPC: B41J2/14 ,  B41J2/16

    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

    Nozzle arrangements
    26.
    发明授权
    Nozzle arrangements 有权

    公开(公告)号：US11034151B2

    公开(公告)日：2021-06-15

    申请号：US16605961

    申请日：2018-03-12

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Galen Cook ,  Garrett E Clark ,  Michael W Cumbie ,  James R Przybyla ,  Richard Seaver ,  Frank D Derryberry ,  Si-lam J Choy

    IPC: B41J2/145 ,  B41J2/14

    Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.

    MOLDED PANELS
    28.
    发明申请
    MOLDED PANELS 审中-公开

    公开(公告)号：US20200094475A1

    公开(公告)日：2020-03-26

    申请号：US16495472

    申请日：2017-05-01

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie

    IPC: B29C64/209 ,  B41J2/14 ,  B41J2/16 ,  B33Y30/00 ,  B29D99/00

    Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

    FLUID EJECTION DEVICE INCLUDING FLUID OUTPUT CHANNEL
    29.
    发明申请
    FLUID EJECTION DEVICE INCLUDING FLUID OUTPUT CHANNEL 审中-公开

    公开(公告)号：US20190315125A1

    公开(公告)日：2019-10-17

    申请号：US16318517

    申请日：2016-11-01

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W Cumbie ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/16

    Abstract: Examples include a fluid ejection die. Examples comprise an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. A fluid input hole is fluidly connected to the ejection chamber. A fluid output channel is also fluidly connected to the ejection chamber, and a fluid output hole is fluidly connected to the fluid output channel. Examples further comprise a fluid pump disposed in the fluid output channel to pump fluid from the ejection chamber out of the fluid output hole.

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