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公开(公告)号:US10589521B2
公开(公告)日:2020-03-17
申请号:US16307072
申请日:2016-10-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Rogelio Cicili , Eric Martin
Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a number of nozzles to eject an amount of fluid. A first field-effect transistor (FET) activates a first fluidic operation component and a second FET activates a second fluidic operation component. The first FET and the second FET are selected from among a high-side switch FET, a low-side switch FET, and a hybrid FET and the first FET and the second FET are different from one another.
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公开(公告)号:US12233645B2
公开(公告)日:2025-02-25
申请号:US18018253
申请日:2020-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Garrett E. Clark , Jeremy Spencer , Vincent C. Korthuis , Rogelio Cicili
IPC: B41J2/045
Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.
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公开(公告)号:US11951739B2
公开(公告)日:2024-04-09
申请号:US17799708
申请日:2020-03-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Gary G. Lutnesky , James R. Przybyla , Rogelio Cicili
CPC classification number: B41J2/14072 , B41J2/04543 , B41J2/0458 , B41J2/04581 , B41J2002/14491 , B41J2202/11 , B41J2202/20
Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.
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公开(公告)号:US11731426B2
公开(公告)日:2023-08-22
申请号:US17311523
申请日:2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Donald J. Milligan , Eric T. Martin , Rogelio Cicili
CPC classification number: B41J2/14153 , B41J2/175 , G01N17/008
Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.
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公开(公告)号:US20230085502A1
公开(公告)日:2023-03-16
申请号:US17799707
申请日:2020-03-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric T. Martin , Rogelio Cicili
IPC: B41J2/045
Abstract: According to examples, an apparatus may include fluid chambers that each includes a fluid actuator and an electrode. The fluid actuators may operate at a first voltage level and a monitoring circuitry may operate at a second voltage level that is lower than the first voltage level. The monitoring circuitry may monitor a condition of each fluid chamber based on a selection signal for selecting an electrode associated with a fluid chamber. The monitoring circuitry including an analog multiplexer that includes, for each of the electrodes for the plurality of fluid chambers, a level shifter to receive the selection signal at the second voltage level and to shift a level of the selection signal. The analog multiplexer may also include an analog pass gate to selectively couple the electrode of a respective fluid chamber to the monitoring circuitry based on the level shifted selection signal.
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公开(公告)号:US20220153020A1
公开(公告)日:2022-05-19
申请号:US17417841
申请日:2019-07-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Rogelio Cicili
IPC: B41J2/045
Abstract: A thermal jet printhead die includes thermal zones. For each thermal zone, the printhead die includes a pair of relative size-scaled temperature sensors to differentially sense a temperature of the thermal zone. A scaling factor between the pair of relative size-scaled temperature sensors for each thermal zone is matched across the thermal zones.
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公开(公告)号:US20220097360A1
公开(公告)日:2022-03-31
申请号:US17311430
申请日:2019-06-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Rogelio Cicili
IPC: B41J2/045
Abstract: In example implementations, an apparatus is provided. The apparatus includes a power supply, a first switch coupled to the power supply, a second switch coupled to the first switch, a third switch coupled to the power supply, the first switch, and the second switch, and a resistor coupled to the third switch. The first switch is to be controlled via a high voltage logic. The second switch is to be controlled via a low voltage logic. The resistor is to generate heat when energized. The first switch and the second switch are to control activation of the third switch to energize the resistor and cause a nozzle chamber to dispense a printing fluid.
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公开(公告)号:US11186081B2
公开(公告)日:2021-11-30
申请号:US16317891
申请日:2016-10-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Daryl E Anderson , Eric Martin , James Michael Gardner , Rogelio Cicili
IPC: B41J2/045
Abstract: Example implementations relate to current leakage testing of a fluid ejection die. For example, a fluid ejection die may include plurality of nozzles, each nozzle among the plurality of nozzles including a nozzle sensor and a fluid ejector. The plurality of nozzle sensors may comprise a first subset and a second subset, each nozzle sensor among the plurality of nozzle sensors of the first subset may be electrically coupled to a first control line by a respective switch among a first group of switches, and each nozzle sensor among the plurality of nozzle sensors of the second subset may be electrically coupled to a second control line by a respective switch among a second group of switches. The fluid ejection die may include a control circuit to perform a current leakage test of the plurality of nozzles using the first control line and the second control line.
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公开(公告)号:US20210323301A1
公开(公告)日:2021-10-21
申请号:US17251241
申请日:2018-11-16
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Rogelio Cicili , James Michael Gardner , Eric Thomas Martin , Daryl E. Anderson
Abstract: Examples of a fluidic die for temperature sensing are described herein. In some examples, the fluidic die includes a plurality of resistor segments connected in series. In some examples, the fluidic die may include a plurality of first switches connected to a first side of each of the plurality of resistor segments. In some examples, the fluidic die includes a plurality of second switches connected to a second side of each of the plurality of resistor segments. In some examples, the fluidic die includes a differential amplifier to output a temperature voltage signal, where a first input of the differential amplifier is each of the first switches, and where a second input of the differential amplifier is connected each of the plurality of second switches.
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公开(公告)号:US20200309666A1
公开(公告)日:2020-10-01
申请号:US16760933
申请日:2017-12-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Martin , James Michael Gardner , James A. Feinn , Rogelio Cicili
Abstract: A fluid particle concentration detection device may include at least one electrode disposed within a fluidic passageway of a fluidic die, and control circuitry to activate the electrode within the fluidic die. An impedance sensed at the electrode corresponds to a particle concentration within the fluid.
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