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    Recirculation bypass
    22.
    发明授权
    Recirculation bypass 有权

    公开(公告)号：US12023937B2

    公开(公告)日：2024-07-02

    申请号：US17798902

    申请日：2020-03-11

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Jacob M. Lum ,  Si-lam J. Choy ,  Jeffrey R. Pollard ,  Tsuyoshi Yamashita ,  Jeremy Sells ,  Garrett E. Clark

    IPC: B41J2/18 ,  B41J2/14

    CPC classification number: B41J2/18 ,  B41J2/1408

    Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.

    MULTI-MODE FLUID EJECTION DIE
    24.
    发明申请
    MULTI-MODE FLUID EJECTION DIE 有权

    公开(公告)号：US20220250378A1

    公开(公告)日：2022-08-11

    申请号：US17414426

    申请日：2019-07-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Eric T. Martin ,  Tsuyoshi Yamashita

    IPC: B41J2/045

    Abstract: In various examples, a fluid ejection die may include an addressing circuit to selectively activate a primitive having a plurality of fluid ejection nozzles in either a first mode or a second mode based on control data received from a fluid ejection system. In the first mode, the addressing circuit may selectively activate, based on the control data, each of the plurality of fluid ejection nozzles during a respective time slice of a first print period. In the second mode, the addressing circuit may selectively activate, based on the control data, each of a plurality of subsets of nozzles of the plurality of fluid ejection nozzles during a respective time slice of a second print period. Moreover, in some examples, the second print period may be a fraction of the first print period.

    Non-nucleation fluid actuator measurements
    25.
    发明授权
    Non-nucleation fluid actuator measurements 有权

    公开(公告)号：US11292250B2

    公开(公告)日：2022-04-05

    申请号：US16965703

    申请日：2018-03-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Eric Martin ,  Tsuyoshi Yamashita ,  James R. Przybyla

    IPC: B41J2/045 ,  B41J2/14

    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of fluid actuators grouped into primitives. Each actuator is disposed in a fluid chamber. The fluidic die also includes an array of fluid sensors. Each fluid sensor is disposed within a fluid chamber and determines a characteristic within the fluid chamber. A data parser of the fluidic die extracts from an incoming signal, firing instructions and measurement instructions for the fluidic die. The measurement instructions indicate at least one of a peak measurement during a nucleation event and a reference measurement during a non-nucleation event. A firing controller generates firing signals based on the firing instructions and a measurement controller activates, during a measurement interval of a printing cycle for the primitive, a measurement for a selected actuator based on the measurement instructions.

    Fluid ejection device
    28.
    发明授权
    Fluid ejection device 有权

    公开(公告)号：US10207516B2

    公开(公告)日：2019-02-19

    申请号：US15546808

    申请日：2015-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Alexander Govyadinov ,  Tsuyoshi Yamashita ,  Erik D Torniainen

    IPC: B41J2/18 ,  B41J2/14 ,  B41J2/175

    Abstract: A fluid ejection device includes a fluid slot, a first fluid ejection chamber communicated with the fluid slot and including a first drop ejecting element, a second fluid ejection chamber including a second drop ejecting element, and a fluid circulation path including a first portion communicated with the fluid slot and the second fluid ejection chamber, and a second portion communicated with the first fluid ejection chamber and the second fluid ejection chamber, with the fluid circulation path including a fluid circulating element within the first portion.

    FLUID EJECTION DEVICE
    30.
    发明申请
    FLUID EJECTION DEVICE 有权
    流体喷射装置

    公开(公告)号：US20130200175A1

    公开(公告)日：2013-08-08

    申请号：US13834524

    申请日：2013-03-15

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Jeffrey R. Pollard ,  Tsuyoshi Yamashita

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14274 ,  B41J2/161 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1646 ,  Y10T156/1052

    Abstract: A fluid ejection device includes a flexible membrane, an adhesive layer, a piezoelectric material layer, and first and second electrically conductive layers. The adhesive layer and the piezoelectric material layer include edge regions and central regions. A surface of the edge region of the piezoelectric material layer is coplanar with a surface of the edge region of the adhesive layer. The first electrically conductive layer is between the piezoelectric material layer and the adhesive layer such that a surface of the first electrically conductive layer is coplanar with the surface of the edge region of the piezoelectric material layer and the surface of the edge region of the adhesive layer. The second electrically conductive layer is over the surface of the edge region of the piezoelectric material layer, the surface of the edge region of the adhesive layer, the surface of the first electrically conductive layer, and the flexible membrane.

    Abstract translation: 流体喷射装置包括柔性膜，粘合剂层，压电材料层以及第一和第二导电层。 粘合剂层和压电材料层包括边缘区域和中心区域。 压电材料层的边缘区域的表面与粘合剂层的边缘区域的表面共面。 第一导电层在压电材料层和粘合剂层之间，使得第一导电层的表面与压电材料层的边缘区域的表面和粘合剂层的边缘区域的表面共面 。 第二导电层在压电材料层的边缘区域的表面，粘合剂层的边缘区域的表面，第一导电层的表面和柔性膜之上。

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