公开(公告)号：US20240098892A1

公开(公告)日：2024-03-21

申请号：US18307886

申请日：2023-04-27

申请人： IBIDEN CO., LTD.

发明人： Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA

IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0373 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/0209

摘要： A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the inorganic particles include first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin, the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin respectively, and the first surface of the resin insulating layer includes a surface of the resin and surfaces of the first portions exposed from the surface of the resin.

公开(公告)号：US20230071257A1

公开(公告)日：2023-03-09

申请号：US17822927

申请日：2022-08-29

申请人： IBIDEN CO., LTD.

发明人： Susumu KAGOHASHI ,  Maaya TOMIDA

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.