公开(公告)号：US20230071257A1

公开(公告)日：2023-03-09

申请号：US17822927

申请日：2022-08-29

申请人： IBIDEN CO., LTD.

发明人： Susumu KAGOHASHI ,  Maaya TOMIDA

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.

公开(公告)号：US20230080335A1

公开(公告)日：2023-03-16

申请号：US17823210

申请日：2022-08-30

申请人： IBIDEN CO., LTD.

发明人： Satoru KAWAI ,  Katsuhiko TANNO ,  Susumu KAGOHASHI ,  Kentaro WADA

IPC分类号： H05K1/03 ,  H05K3/46 ,  G06T7/00

摘要： A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.