公开(公告)号：US10897238B2

公开(公告)日：2021-01-19

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras Eid ,  Georgios C. Dogiamis ,  Valluri R. Rao ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Vijay K. Nair

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/17 ,  H03H9/15 ,  H03H9/02 ,  H03H9/24

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US10887439B2

公开(公告)日：2021-01-05

申请号：US15777093

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H04M15/00 ,  H04M1/02 ,  H01Q1/38 ,  G06F1/16 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q25/00 ,  H01Q1/40 ,  H01Q21/28 ,  H01Q1/24 ,  H01Q21/22 ,  H01Q3/26 ,  H01Q1/22

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10594294B2

公开(公告)日：2020-03-17

申请号：US15088830

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H03H9/13 ,  H03H9/36

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

公开(公告)号：US10484120B2

公开(公告)日：2019-11-19

申请号：US15721868

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Erich N. Ewy

IPC: H04J14/02 ,  G02B6/12 ,  H01S5/024 ,  H04B10/50 ,  H04B10/572 ,  H04B10/90

Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.

公开(公告)号：US10291283B2

公开(公告)日：2019-05-14

申请号：US15088996

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H04B1/48 ,  H03H7/38 ,  H01H57/00 ,  H03H15/00

Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.

公开(公告)号：US10277322B2

公开(公告)日：2019-04-30

申请号：US15965637

申请日：2018-04-27

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

IPC: H04B10/00 ,  H04B10/2575 ,  H04B10/2513 ,  H04J14/00

Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US10256521B2

公开(公告)日：2019-04-09

申请号：US15280823

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01P11/00 ,  H01P5/107

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

公开(公告)号：US11456721B2

公开(公告)日：2022-09-27

申请号：US16648121

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/54

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：US11380624B2

公开(公告)日：2022-07-05

申请号：US16651949

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Feras Eid ,  Henning Braunisch ,  Shawna M. Liff ,  Georgios C. Dogiamis ,  Johanna M. Swan

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/04 ,  H01L23/10 ,  H01L23/498 ,  H01L23/00

Abstract: A device package and a method of forming the device package are described. The device package includes a substrate having a ground plane and dies disposed on the substrate. The dies are electrically coupled to the substrate with solder balls or bumps surrounded by an underfill layer. The device package has a mold layer disposed over and around the dies, the underfill layer, and the substrate. The device package further includes an additively manufactured electromagnetic interference (EMI) shield layer disposed on an outer surface of the mold layer. The additively manufactured EMI shield layer is electrically coupled to the ground plane of the substrate. The outer surface of the mold layer may include a topmost surface and one or more sidewalls that are covered with the additively manufactured EMI shield layer. The additively manufactured EMI shield may include a first and second additively manufactured EMI shield layers and an additively manufactured EMI shield frame.

公开(公告)号：US11283427B2

公开(公告)日：2022-03-22

申请号：US16648639

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/56 ,  H03H9/05 ,  H03H9/13

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.