公开(公告)号：US10068776B1

公开(公告)日：2018-09-04

申请号：US15637969

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Frank Truong ,  Praneeth Akkinepally ,  Shruti R. Jaywant ,  Dilan Seneviratne

IPC: H01L21/3105 ,  H01L21/312 ,  H01L21/4757 ,  H01L23/528 ,  H01L21/768 ,  H01L21/02

CPC classification number: H01L21/31053 ,  H01L21/02354 ,  H01L21/31058 ,  H01L21/76805 ,  H01L21/76819 ,  H01L21/76885 ,  H01L22/12 ,  H01L22/30 ,  H01L23/498 ,  H01L23/5283

Abstract: An interlayer dielectric material includes a planar surface that exhibits planarity due to raster-patterned decomposition products due to use of a confocal light beam. The planar surface encompasses a filled via that is in electrical and physical contact with a bond pad that is also on the planar surface.