公开(公告)号：US20150082811A1

公开(公告)日：2015-03-26

申请号：US14036655

申请日：2013-09-25

Applicant: Intel Corporation

Inventor： Thanunathan Rangarajan ,  Rahul Khanna ,  Richard Marian Thomaiyar ,  Minh T. Le

IPC: F25B21/02

CPC classification number: F25B21/02 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/171 ,  Y02D10/172

Abstract: In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，处理器包括热电冷却（TEC）控制器，以获得与处理器相关联的平台冷却水平; 获得与处理器相关联的温度; 至少部分基于平台冷却水平和温度计算TEC功率水平; 并且向与处理器相关联的TEC设备提供TEC功率级，其中TEC设备将热量从处理器传送到散热器。 描述和要求保护其他实施例。