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公开(公告)号：US10716241B2
公开(公告)日：2020-07-14
申请号：US14473395
申请日：2014-08-29
Applicant: INERTECH IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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公开(公告)号：US20200163250A1
公开(公告)日：2020-05-21
申请号：US16653509
申请日：2019-10-15
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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23.发明授权公开(公告)号：US10345012B2
公开(公告)日：2019-07-09
申请号：US15715783
申请日：2017-09-26
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Earl Keisling
Abstract: Cooling systems and methods use first and second evaporators and first and second liquid refrigerant distribution units to increase the efficiency of the cooling systems and methods. The first evaporator is in thermal communication with an air intake flow to a heat load, and the first liquid refrigerant distribution unit is in thermal communication with the first evaporator. The second evaporator is disposed in series with the first evaporator in the air intake flow and is in thermal communication with the air intake flow, and the second liquid refrigerant distribution unit is in thermal communication with the second evaporator. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator when the temperature of the first fluid flowing out of a main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.
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公开(公告)号：US10254021B2
公开(公告)日：2019-04-09
申请号：US14520322
申请日：2014-10-21
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
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公开(公告)号：US09839163B2
公开(公告)日：2017-12-05
申请号：US15362487
申请日：2016-11-28
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
CPC classification number: H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
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Patent Agency Ranking
公开(公告)号：US20170079165A1
公开(公告)日：2017-03-16
申请号：US15362487
申请日：2016-11-28
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20
CPC classification number: H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
Abstract translation: 用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。 第一热交换器联接到第一支撑构件，其构造成将第一热交换器与至少一个服务器的热传递关系定位。 第一热交换器不连接到至少一个服务器机架。 模块化服务器机架冷却结构还应用于包括至少第一机架和至少彼此相对设置的第二机架以形成热通道或冷通道的系统。 公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力要求而不需要额外空间的方法。
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27.发明申请MULTI-STAGE EVAPORATIVE HEAT REJECTION PROCESS CYCLE THAT FACILITATES PROCESS COOLING EFFICIENCY, WATER PRODUCTION, AND/OR WATER RECLAMATION FOR FLUID COOLERS AND COOLING TOWERS 审中-公开多级蒸发热排放过程循环过程冷却效率，水的生产和/或水回收流体冷却器和冷却功能公开(公告)号：US20140338391A1
公开(公告)日：2014-11-20
申请号：US14217723
申请日：2014-03-18
Applicant: Inertech IP LLC
Inventor： Earl Keisling
CPC classification number: F25B39/02 , F24F5/0035 , F25B23/006 , F25B25/00 , F25B2339/047
Abstract: An evaporative heat rejection cycle for cooling a heat load is presented, including an environmental pre-cooling primary evaporator, an environmental pre-cooling secondary evaporator, a pre-cooled evaporative heat rejection cycle section in thermal communication with a heat load, and a primary pre-cooling evaporative heat exchanger in thermal communication with air that is drawn into thermal communication with a primary evaporator cycle, to enable heat transfer and moisture elimination from the air to a first fluid, where a portion of the first fluid evaporates and absorbs heat and condenses moisture from the air.
Abstract translation: 提出了一种用于冷却热负荷的蒸发排热循环，包括环境预冷初级蒸发器，环境预冷二次蒸发器，与热负荷热连通的预冷却的蒸发排热循环段，以及初级 预冷却蒸发热交换器与空气热交换，其与主蒸发器循环热连通，以使得能够从空气到第一流体的热传递和湿气消除，其中第一流体的一部分蒸发并吸收热量， 冷凝空气中的水分。
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公开(公告)号：US20250024648A1
公开(公告)日：2025-01-16
申请号：US18779868
申请日：2024-07-22
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.
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公开(公告)号：US20240268082A1
公开(公告)日：2024-08-08
申请号：US18407424
申请日：2024-01-08
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
CPC classification number: H05K7/20745 , F21V33/0092 , F21W2131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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公开(公告)号：US11871544B2
公开(公告)日：2024-01-09
申请号：US18086577
申请日：2022-12-21
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
CPC classification number: H05K7/20745 , F21V33/0092 , F21W2131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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