公开(公告)号：US09040354B2

公开(公告)日：2015-05-26

申请号：US14184856

申请日：2014-02-20

Applicant: Infineon Technologies AG

Inventor： Gunther Mackh ,  Gerhard Leschik ,  Adolf Koller ,  Harald Seidl

IPC: H01L21/78 ,  H01L23/58 ,  H01L21/82 ,  G06F17/50

CPC classification number: H01L21/78 ,  G06F17/5068 ,  H01L21/82 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.

Abstract translation: 芯片包括电介质层中的电介质层和填充结构，其中填充结构沿芯片的切割边缘延伸，填充结构邻接切割边缘。

公开(公告)号：US20140338827A1

公开(公告)日：2014-11-20

申请号：US13895241

申请日：2013-05-15

Applicant: Infineon Technologies AG

Inventor： Adolf Koller ,  Franco Mariani ,  Katharina Umminger

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L21/67115 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1917 ,  Y10T156/1994

Abstract: Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is removed from a carrier.

Abstract translation: 提供了将分离剂施加到基底的至少一部分的方法和装置。 将衬底的至少一部分从载体上去除。